Production of a sintered ceramic dielectric formed from a green sheet having a uniform microporous structure providing uniform dielectric properties and compressibility for lamination of stacked green sheets into a unitary laminate which may be provided with an internal pattern of electrical conductors extending therein. The structure is obtained by blending the ceramic particulate in a solution of a binder resin miscible in a solvent mixture which is formed from a volatile solvent for the binde...

Production of a sintered ceramic dielectric formed from a green sheet having a uniform microporous structure providing uniform dielectric properties and compressibility for lamination of stacked green sheets into a unitary laminate which may be provided with an internal pattern of electrical conductors extending therein. The structure is obtained by blending the ceramic particulate in a solution of a binder resin miscible in a solvent mixture which is formed from a volatile solvent for the binde...

A group of dielectric compounds and mixtures of dielectric compounds with useful properties at microwave frequencies is disclosed. The dielectric materials are temperature compensated, have relatively high dielectric constants, and comprise the group of BaTi.sub.4 O.sub.9, and mixtures of Li.sub.2 TiO.sub.3 and Li.sub.4 Ti.sub.5 O.sub.12, MgTi.sub.2 O.sub.5 and TiO.sub.2, Zn.sub.2 TiO.sub.4 and TiO.sub.2, and BaTi.sub.4 O.sub.9 and TiO.sub.2.

Production of a sintered ceramic dielectric formed from a green sheet having a uniform microporous structure providing uniform dielectric properties and compressibility for lamination of stacked green sheets into a unitary laminate which may be provided with an internal pattern of electrical conductors extending therein. The structure is obtained by blending the ceramic particulate in a solution of a binder resin miscible in a solvent mixture which is formed from a volatile solvent for the binde...

A nucleating agent comprising either a substantially non-polar wax or an inert inorganic finely divided powder is incorporated in a thermoplastics polymer, e.g. polyethylene. Thus reduces the spherulite size of the material and thus increases its breakdown field strength.

Polymeric dielectrics, which comprise 60 to 79 % by mole of repeating units derived from vinylidene fluoride, 18 to 22 % by mole of repeating units derived from trifluoroethylene and 3 to 22 % by mole of repeating units derived from chlorotrifluoroethylene, have high dielectric constant.

A capacitor system which uses a wide range of liquid organic solvents as its dielectric medium. Illustrative examples of the dielectric materials contemplated by this invention are listed as follows: 4-butyrolactone, 4-valerolactone, dimethyl sulfoxide, N-methylpropionamide, propylene carbonate, acetonitride, N-n-butylacetamide and a mixture of ethylene carbonate and propylene carbonate.

The present invention relates to a novel nanocomposite dielectric comprising a polymer matrix and a plurality of carbon nanotubes dispersed therein. A method for increasing a dielectric constant of a polymer matrix, as well as a laminate and mobile antenna comprising the novel dielectric are also disclosed.

A ceramic composition for dielectrics, consisting essentially of an inorganic dielectric material including at least one electrically insulating glass and at least one organic binder, and further comprising at least one inorganic peroxide. The inorganic peroxide serves to facilitate burnout or removal of the organic binder during firing of the ceramic composition and minimizes the content of residual carbon in the fired ceramic composition. The inorganic peroxide is preferably selected from the ...

The present invention teaches a new method for formation of thin dielectrics over polysilicon. This technique permits the fabrication of poly-to-poly capacitors with high specific capacitance (capacitance per unit area). This technique is completely compatible with standard MOS dual poly regrown gate oxide processes. The high value of specific capacitance is achieved by using a composite dielectric which has high dielectric integrity and whose thickness is completely independent of the formation...