Apparatus and method are disclosed for forming encapsulated material. Centrifugal force developed by a rotating nozzle having a plurality of radial orifices is used for extruding material to be encapsulated. The nozzle is mounted for rotation about a generally vertical axis and is provided with a circumferential outside surface near its bottom inclined upwardly away from the axis of the nozzle which, when partially submerged in a liquid during rotation, impels a sheet or spray of the liquid alon...

An encapsulating composition for electronic devices comprises a curable material such as a silicone resin and an ion scavenger compound selected from certain calixarene or oxacalixarene compounds in which at least half of the phenolic groups have been substituted by specific groups and certain silacrown compounds. Exemplary ion scavenger compounds include ##STR1## the tetraethyl acetate of 7, 13, 19, 25-tetra-tertbutyl-27, 28, 29, 30-tetrahydroxy-2,3-dihomo-3-oxacalix-4-arene and 1,1-dimethasila...

Method for encapsulating components utilizing individually evacuatable molds for receiving the components which may be separated and removed from the means evacuating the mold without loss of vacuum and positioned within an evacuated chamber where the molds may be opened and the component encapsulated under vacuum. The mold with encapsulated component may thereafter be subjected to atmospheric pressure and the encapsulant cured.

Method is disclosed for forming encapsulated material. Centrifugal force developed by a rotating nozzle having a plurality of radial orifices is used for extruding material to be encapsulated. The nozzle is mounted for rotation about a generally vertical axis and is provided with a circumferential outside surface near its bottom inclined upwardly away from the axis of the nozzle which, when partially submerged in a liquid during rotation, impels a sheet or spray of the liquid along the circumfer...

A method for encapsulating an area on a substrate comprising the steps of a) providing a substrate having an area on a surface thereof which is to be encapsulated, b) providing an assembly fixture which has features formed into the surface of the fixture, and vacuum orifices associated with the features of the fixture, c) positioning a substantially flat formable sheet onto the assembly fixture, and forming the sheet to the features of the assembly fixture by applying a negative pressure through...

The apparatus and method employ upper and lower laminating films, having opposed layers of heat activated adhesive. The laminating films are brought together at the surface of an infeed roller which is positioned in front of two opposed heated laminating rollers. The laminating films are brought together at the infeed roller at such angles that an infeed shelf is formed and such that an article may be fed between the upper and lower films as they pass about the infeed roller. The article being l...

An encapsulating composition for electronic devices comprises a curable material such as an epoxy resin and an ion scavenger compound selected from certain calixarene or oxycalixarene compounds in which at least half of the phenolic groups have been substituted by specific groups and certain silacrown compounds. Exemplary ion scavenger compounds include ##STR1## the tetraethyl acetate of 7, 13, 19, 25-tetra-tertbutyl-27, 28, 29, 30-tetrahydroxy-2,3-dihomo-3-oxacalix-4-arene and 1,1-dimethasila-1...

A layer of coating bonded to a substrate is encapsulated to prevent portions of the layer from becoming detached and randomly distributed. This is accomplished by applying a first layer of an adhesive to the exposed surface of the layer to be encapsulated. A second layer composed of a fibrous material is placed in contact with the first layer of adhesive and then an additional layer of adhesive is applied by a suitable technique such as brushing or coating. The additional layer of adhesive penet...

An encapsulation for an electrical device is disclosed. A cap support is provided in the non-active regions of the device to prevent the package from contacting the active components of the device due to mechanical stress induced in the package.

An encapsulating grommet for use with a push-pin for retaining a covering panel or other structure to a supporting panel is molded in an open condition and includes a hinge portion which permits one half of the encapsulating grommet to be folded against the other half. One of the two halves includes a rectangular frame having an opening surrounded by an umbrella-like flange. The other half snap-fits into the rectangular frame when closed so that the encapsulating grommet may be shipped in a clos...