Compositions containing: (a) a liquid epoxy resin; (b) an aliphatic or cycloaliphatic primary monoamine and/or an aliphatic or cycloaliphatic disecondary diamine; (c) a latent curing agent for the epoxy resin (a) which does not react until temperatures above 70.degree. C. (measured by means of DSC at a heating rate of 10.degree. C./min); (d) a photopolymerizable compound; and (e) a photoinitiator; the ratio of the number of equivalents of epoxy groups to that of photopolymerizable groups being 1...

This invention concerns an epoxy coating for use as a non-skid surface for applications such as the deck of an aircraft carrier. The epoxy coating can be formulated from (a) an amine curing agent, (b) an epoxide-containing toughening agent such as a polysulfide and/or a polythioether, (c) an epoxy resin, (d) a rubber toughening agent, and (e) an optional fire retardant, a glass fiber thixotrope and impact toughening agent, an optional pigment, an optional corrosion inhibitor, an optional moistur...

A system, means, and method for concurrently producing a plurality of different and irregular subcombinations by molding the subcombinations an an epoxy resin and numerical control machine processing the subcombinations.

In the present invention an adhesive composition is provided. The adhesive composition includes epoxidized cashew nutshell liquid, a catalyst, and diglycidyl ether of bisphenol A. The invention may further include at least one additive selected from the group including curing agents, bonding enhancers, hardeners, flexibilizers, tackifiers, and mixtures thereof.

Epoxy acrylates and carboxyl group-containing epoxy acrylates of formulae III and IV of the claims that are relatively polymolecular and are chemically crosslinkable can be used in photoresist formulations with the additional use of highly polymerized polymer binders. Such resist formulations are used in particular in the field of printed circuit boards and printing plates, are applicable from aqueous medium, are almost tack-free and have very good edge coverage, especially on conductors.

The present invention is directed to fast reacting epoxy compositions employing select unidentate and chelated Ti(IV) and Sn(II) curing catalysts.

An epoxy-sulfonylazide having the general formula ##STR1## wherein R is lower alkyl and R' is hydrogen or lower alkyl.

By mixing one part of a prepolymer containing a polyamine partially polymerized with an organic epoxide and subsequently reacted with a fatty acid containing from 8 to 32 carbon atoms, and then reacting this prepolymer mixture with 3 parts of an organic epoxide, a composition was obtained which made a gas frothable, shear-stable, room temperature curing, low density foam. A particularly advantageous prepolymer was prepared using a polyamine selected from the group consisting of diethylenetriamin...

Novel epoxy acrylates and carboxyl group-containing epoxy acrylates of formulae II and III of the claims that are relatively highmolecular and are chemically crosslinkable can be used in photoresist formulations with the additional use of highly polymerised polymer binders. Such resist formulations are used in particular in the field of printed circuit boards and printing plates, are applicable from aqueous medium, are almost tack-free and have very good edge coverage, especially on conductors.

Disclosed is a heat-resistant flame-retardant epoxy resin composition comprising a halogen-containing epoxy resin obtained by reacting a trifunctional epoxy compound having a specific structure with a halogenated bisphenol in the presence of a catalyst. Furthermore, a novel specific trifunctional epoxy compound is disclosed, which is valuably used for the production of the above-mentioned halogen-containing epoxy resin.