An electrical assemblage reduces heat generated by components during operation. The assemblage has at least one heat-generating component, typically a resistor, and at least one heat-removing element electrically associated with the heat-generating component. Heat-removing element comprises a plurality of vias therein and is fixedly attached to a tip of the electrical components, typically on opposed charged ends. Heat absorbed by the heat-removing element is then transported to a heat sink, coo...

Method for securing tubular piling or pile casing in the ground which comprises inserting tubular piling into the ground, preferably heavy piling adapted to be driven into the ground, inserting an expandable mechanism, e.g., an expandable hydraulically actuated mandrel, into the tubular piling at one or more spaced intervals or positions longitudinally along the piling, expanding the mechanism at each such position to expand the piling outwardly to form one or more protrusions spaced longitudina...

An integral transfer tube is produced comprised of a hollow high density ceramic oxide tube having its outer surface wall surrounded by a low density multilayered ceramic oxide shell, and having a heating element comprised of a heating wound portion and two end portions wherein the wound portion is intermediate the tube and the shell, and wherein at least a sufficient amount of the end portions are exposed for electrical attachment.

A semiconductor substrate having thereon a surface including features to be filled is placed in a vacuum chamber having a high density plasma source and a target of material to be deposited. A vacuum is drawn, and a plasma is struck in a gas by means of the high density plasma source. The substrate is then biased to cause ions from the plasma to bombard the substrate with energies sufficient to facet top corners of features on the surface of the substrate. After a desired amount of faceting has ...

A portable, hand-held spectrophotometric probe detects the concentration of a material dissolved in a liquid bath. The probe has an elongate hollow handle with an open lower end. A transparent cylindrical cell is attached to the lower end of the handle and fills with liquid when the cell is immersed in the bath. A source of light whose spectrum includes an absorption band of the dissolved material is mounted in the handle and transmits light through the cell to a photodetector. The photodetector...

Mineral values are recovered from underground formations, and pollution of the formation is substantially diminished if not eliminated, by determining the geometry of an ore body and thereafter isolating the body by the formation of an impermeable barrier thereabout which has the capability of retaining leaching fluid therewithin. Leaching fluid remains downhole without substantial dilution by formation fluid, and conversely without pollution of the surrounding formation, until the mineral value...

A reduced metal-rich interface between a poly and metal silicide layer is achieved by insitu doping the metal silicide layer.

A method of forming an oxide on a substrate. According to the method of the present invention a substrate is placed in a chamber. An oxygen containing gas and a hydrogen containing gas are then fed into the chamber. The oxygen containing gas and the hydrogen containing gas are then caused to react with one another to form water vapor in the chamber. The water vapor then oxidizes the substrate.

A testing apparatus for measuring soil shear strength which includes a torque motor connected to a torque shaft, torque cell and vane which extend beneath the soil surface. The torque cell is located between the shaft and the vane; and measures soil shear strength. It includes a torque transmission member on which an electrical transducer is mounted; and a housing which surrounds the transmission member and defines an annular cavity which protectively surrounds the transducer.

Methods for manufacturing microchips are provided. A plurality of alternating metallic wiring-layers and non-metallic layers, terminating with a metallic wiring-layer, are formed on a wafer. A plurality of vias is formed for electrically interconnecting various metallic wiring-layers. A plurality of electrically conducting pads is formed adjacent various vias. A passivation layer is formed adjacent the terminal metallic wiring-layer and the plurality of conducting pads. A portion of the passivat...