An interconnect includes a pad and at least two vias coupled to the pad. In one embodiment, the pad has five substantially straight edges, one via directly coupled to the pad by being formed substantially beneath the pad, and one via coupled to one of the five substantially straight edges by a tapered conductive segment. In another embodiment, the pad has three vias directly coupled to the pad and formed substantially beneath the pad. A method of forming an interconnect includes forming at least...

The interconnect logic circuit for supplying input data to a register and recirculating data in the register includes a programmable logic array (PLA) and a recirculation control circuit connected between an output of the PLA and an input of the register and between an output and an input of the register. The recirculation control circuit includes a first transfer gate for sensing and storing information corresponding to the presence or absence of a command to supply input data, and a second tra...

Disclosed is a method of connecting a first component, including a first electrical conductor, to a second component, including a second electrical conductor, which involves the steps of positioning the first component proximate to the second component to establish a juncture area, covering the juncture area with an insulating layer to form a smooth surface transition between the first and second components, and depositing a third conductor across the insulating layer and in electrical contact w...

A microwave interconnect for integrated or hybrid circuits includes a flexible sheet bearing a flexible conductor which is divided into a plurality of insulated conductive lines, at least some of which make contact with the integrated or hybrid circuit, as well as with a second circuit to which the first is thereby connected. The flexible sheet is backed by a body of elastomeric material and a compression bar which assures good electrical contact of the flexible conductor with the circuits when ...

An interconnect circuit for use in a computer system employing horizontal architecture and having multiple resources of which the use must be scheduled in an optimum manner. The interconnect circuit reduces scheduling to a mechanical task by providing multi-word storage capability at each of a plurality of cross-points connected in data flow paths between the computer resources. At each cross-point of the interconnect circuit, data may be written into a selected location and retrieved from a sel...

A local interconnect system for VLSI integrated circuits. After titanium is deposited for self-aligned silicidation of exposed moat and gate regions in a nitrogen atmosphere, a hardmask is deposited and patterned over the titanium. When a conductive titanium nitride layer is formed overall, it will already be patterned according to this hardmask.

Wells in a substantially impermeable subterranean earth formation that tends to fracture along non-intersecting vertical planes of natural weakness are interconnected by initially fracturing at least one of the well boreholes along its vertical plane of natural weakness, filling the fracture with a granular material, and refracturing the well borehole by pumping in a viscous fluid at a rate causing the pressure to rise above the pressure at which the first fracture was formed. The last-mentioned...

An electrical interconnect system includes a circuit terminal member having a plurality of contact posts extending therefrom. An electrical connector for attaching to said terminal includes first and second plates which are movable to first and second positions thereby engaging or disengaging contact members extending from said plates and said contact posts of said terminal member.

An integrated circuit having a metal interconnect system formed with molybdenum engaging all contact areas of N conductivity type regions and aluminum engaging said molybdenum and engaging all contact areas of P conductivity type regions.

A discretionary interconnect which includes orthogonal arrays of conductors sandwiched between conductive planes and accessible through a number of selectively arranged vias for interconnection and interruption. Also disclosed is a process of personalizing an interconnect of this type by selectively connecting and disconnecting the conductors.