The fabrication of a microcircuit by beam lithography requires an economic distribution of processing time between the high resolution portions of the exposure pattern and areas of much lower resolution. At least one ion beam provides the high resolution performance and at least one electron beam satisfies the lower resolution requirement. The beams are independently operable and are relatively inclined for substantial convergence at the substrate. The convergence is such that all beams can be s...

A microcircuit board for use with integrated circuits includes at least one thin film land to which components are to be soldered. The land is divided into solderable and nonsolderable areas, and the amount of solder that is preliminarily applied to the land will be determined by the ratio of the solderable areas to the non-solderable areas.

A passive microcircuit is made, according to the invention, on a metal substrate, a dielectric layer being coated on at least one of its sides, whereon all components of the passive microcircuit, current-carrying tracks, pads, capacitor electrodes and resistors, are arranged. All the components and a dielectric layer of the passive microcircuit are based on the material of the metal substrate. The proposed passive microcircuit ensures dense wiring, directed heat removal, high reliability and sho...

A high frequency or microwave microcircuit device is disclosed having application as an integrated circuit element for electromagnetic signal frequency conversion performing, for example, frequency conversion functions such as signal mixing or signal detection. The novel microcircuit element is particularly adapted for use in planar integrated microstrip transmission line systems.

A method and apparatus for protecting hypersensitive microcircuits on the face of a semiconductor wafer from contamination and mechanical damage during die sawing and subsequent die handling operations include the provision of a plastic sheet having an array of protective domes formed into it, the array corresponding to the array of microcircuits on the wafer, and the temporary adhesion of the sheet to the face of the wafer such that each die in the wafer is covered by a respective one of the do...

The connector includes a support plate for the major face of the card opposite the face which carries contact zones. It defines a path for the insertion of the card in a given direction and includes an end-of-travel microswitch which is actuated by the front edge of the card when the latter reaches and exceeds a given position. A rocker is rotatable on the microswitch housing about an axis which is orthogonal to the direction of insertion of the card, parallel to the support plane on the plate a...

A microcircuit package and sealing method in which a non-organic coating is used to hermetically seal the microcircuit. The microcircuit is isolated and insulated in order to protect the microcircuit from the high temperature required to apply and cure a non-organic coating. The materials and methods used to isolate and insulate the microcircuit are chosen so that the thermal coefficients of the materials are complementary and thus form a highly reliable, durable seal, while also insulating the ...

A circuit, for incorporation into an electrical system, for providing a clock signal frequency to other circuitry such as a microprocessor and/or co-processor circuitry. The clock signal frequency varies its speed depending on the available voltage and current from a host power source. The circuit maximizes clock frequency by lowering the available voltage and increasing the available supply current. The circuit can therefore provide a higher clock speed and more current for switching transistor...

A microcircuit resistor stack, which comprises of at least one set of equal value resistors connected in series providing a course trim, the at least one set of equal value resistors having at least two resistor; and at least one wirebond configuration, the at least one wirebond configuration being able to provide the fine resolution trim of the resistor stack.

A turbine airfoil includes a plurality of cooling circuits embedded within the pressure and suction sidewalls and a first and a second flow passage. The first flow passage feeds the coolant fluid to the cooling circuits that are embedded only within the pressure sidewall and the second flow passage feeds the coolant fluid to the cooling circuits that are embedded only within the suction sidewall. A method embodiment of the present comprises placing the inlets of the cooling circuits embedded wit...