The difficulties associated with electroplating palladium metal or alloy deposits from palladium diammino dichloride, palladium diamino dinitrite and palladium triammino sulphite baths can be avoided by plating from palladium baths containing oxalate. The palladium and oxalate may be in a single complex, such as palladium diamino oxalate, (Pd(NH.sub.3).sub.2 C.sub.2 O.sub.4), palladium tetraamino oxalate (Pd(NH.sub.3).sub.4 C.sub.2 O.sub.4) or an ammonium or alkali metal salt of palladium dioxal...

A family of alloys for use in medical, electrical contact and jewelry applications includes as primary components palladium, and boron and at least one of ruthenium, rhenium, platinum, gold, zirconium, tungsten, cobalt, nickel, tantalum and iridium. An alternative embodiment includes palladium and rhenium and/or ruthenium with an additional element iridium, platinum, tungsten, boron, gold, zirconium, cobalt, nickel and tantalum. The present alloy family has a high strength, high radio opacity, a...

An electroplating bath for the deposition of palladium from a palladium-urea complex. A method for depositing palladium from a chemical solution containing a palladium-urea complex by passing an electric current through the solution, whereupon palladium deposits on the surface of a workpiece or a cathode.

Palladium catalysts can be obtained by vapor depositing metallic palladium on a carrier, treating the palladium coating with a metallic inhibitor by vapor deposition, and heating the product at from 300.degree. to 800.degree. C., and can be used for the partial hydrogenation of triple bonds to olefinic double bonds.

Improvement on the recovery of palladium from aqueous acidic solutions employing ketoximes, including novel ether oximes and palladium complexes, comprising contacting the aqueous acidic solution containing the palladium with an organic solvent containing the oxime to form two immiscible phases, separating the organic and aqueous acidic phases and stripping the palladium values from the organic phase using an aqueous ammonia solution. The organic phase may contain phase transfer agents and modif...

An electroplating bath composition is disclosed which permits high speed palladium deposition. The bath comprises carbonate or phosphate anion in a critical amount and is otherwise additive free. A pH of 7-9 is used.

The invention relates to a method for high speed palladium electroplating by immersing the object to be plated in an ammoniacal solution of a palladium tetra-amino complex ion, palladium metal in a concentration of at least 10 g/l, and at least one carbonate or phosphate anion in a concentration of more than about 7.5 g/l and less than about 150 g/l. The solution has a pH of between about 7 and 9 and is free of quaternized pyridinium brightening agents. Palladium is plated into a substrate with ...

The palladium complex disclosed herein is bis[tri(orthotolyl)phosphine] palladium which is produced by reacting a palladium salt with tri(ortho-tolyl)phosphine and reducing the resultant bis[tri(ortho-tolyl)phosphine] palladium salt with an alcoholic alkali. This complex is useful as a catalyst for the production of 1,3-diene oligomers.

There is provided a novel extractant for palladium capable of improving an extraction speed in comparison with a case of utilizing a DHS being a conventional extractant, and a method for separation and recovery of palladium utilizing the same. The present invention provides a method for obtaining a palladium-containing aqueous solution by bringing an organic phase containing an extractant of a sulfur-containing diamide compound represented by the following structural formula (1): ##STR00001## in...

Disclosed is a palladium electroplating bath and a method of plating therewith. The bath contains palladium as the palladosammine chloride and a phosphonic compound which is an alkylene diamine phosphonate derivative. The bath may be employed to plate palladium or its alloys. In a preferred embodiment, a pure palladium deposit may be obtained which exhibits very low porosity even after subsequent cold forming of the article on which it is deposited.