In fossil boilers and steam generator of fossil boilers and nuclear power plants, a son-air detector using ultrasonic transducers is employed with a glandless motor pump which may have a vertical top vent pipe to ascertain with fast response if the vent pipe has liquid or not. In the glandless motor pump, the pumped primary liquid per se is used for lubricating the bearings of the motor, whereby, if the lubricating liquid is absent, the motor operation should not be continued. For redundancy, a ...

A network includes a plurality of wirelessly interconnected self-organizing network (SON) devices for relaying signals in a self-organizing network and a field device for originating output signals. The sensor is configured to transmit the output signals to at least one of the SON devices, and the SON devices do not originate signals but only relay signals originated externally. At least one of the SON devices is self-powered by harvesting energy from an adjacent energy source.

A post-mold plated semiconductor device has an aluminum leadframe (105) with a structure including a chip mount pad and a plurality of lead segments without cantilevered lead portions. A semiconductor chip (210) is attached to the chip mount pad, and conductive connections (212) span from the chip to the aluminum of the lead segments. Polymeric encapsulation material (220), such as a molding compound, covers the chip, the connections, and portions of the aluminum lead segments without leaving ca...

Isolated DNA molecules comprising a nucleotide sequence encoding murine son of sevenless gene 1 (mSOS1) polypeptide and comprising a nucleotide sequence encoding murine son of sevenless gene 2 (mSOS2) polypeptide are disclosed, as well as isolated mSOS1 polypeptide and isolated mSOS2 polypeptide, and diagnostic methods using the same.

A semiconductor device includes first and second semiconductor layers and first and second MOS transistors. The first semiconductor layer is provided on and electrically connected to the semiconductor substrate. The second semiconductor layer is provided near the first semiconductor layer and formed above the semiconductor substrate via one of an insulating film and a cavity. The first and second MOS transistors are respectively provided on the first and second semiconductor layers, and each has...

A patterned SOI/SON composite structure and methods of forming the same are provided. In the SOI/SON composite structure, the patterned SOI/SON structures are sandwiched between a Si over-layer and a semiconductor substrate. The method of forming the patterned SOI/SON composite structure includes shared processing steps wherein the SOI and SON structure are formed together. The present invention also provides a method of forming a composite structure which includes buried conductive/SON structur...

An endoscope system wherein a first electronic endoscope apparatus and second electronic endoscope apparatus are used as combined characterized in that a field sequential illuminating system forming a first electronic endoscope apparatus and a field sequential illuminating system forming a second electronic endoscope apparatus are synchronized by a synchronizing signal to make an illumination so that neither apparatus may produce such deterioration of the picture quality as the break of the colo...

A method for fabrication of silicon-on-nothing (SON) MOSFET using selective etching of Si.sub.1-xGe.sub.x layer, includes preparing a silicon substrate; growing an epitaxial Si.sub.1-xGe.sub.x layer on the silicon substrate; growing an epitaxial thin top silicon layer on the epitaxial Si.sub.1-xGe.sub.x layer; trench etching of the top silicon and Si.sub.1-xGe.sub.x, into the silicon substrate to form a first trench; selectively etching the Si.sub.1-xGe.sub.x layer to remove substantially all of...

Upon the manufacture of a non-leaded type semiconductor device having an encapsulater, and a gate cured resin and air vent cured resins which remain as a result of the exposure of leads and tub-suspension leads to a mounting surface of the encapsulater and the formation of the encapsulater, a groove through which a resin flows, is not provided over the full circumference of a cavity defined in a mold die for forming the encapsulater. A gate and air vents are provided outside an area in which no ...