An improved transistor, such as a control transistor, of the type having a plurality of strip-like emitter regions formed in a single base region in a semiconductor body. The strip-like emitter regions are of different widths and preferably are positioned in spaced side by side relationship and decrease in width in the direction of succession of the strips.

A transistor which has a plurality of ring emitter transistor units formed on a common semiconductor substrate having one conductivity type, each ring emitter transistor unit being provided with a base region of the opposite conductivity type from the semiconductor substrate and formed on its surface, an emitter region of the same conductivity type as the semiconductor substrate and formed in the base region to a depth smaller than the latter to have a ring-shaped plane configuration, a base ele...

A method of making a transistor by forming a layer of high resistivity on a semiconductor collector body, diffusing a base zone into the layer to a depth less than the thickness of the layer and then forming an emitter zone in the base zone.

In a transistor wherein a plurality of emitter regions are formed in a base region, resistor regions which have the opposite conductivity type to the conductivity type of the emitter regions and which act as stabilizing resistors, are formed in the emitter regions. The resistors regions are commonly connected through an emitter wiring electrode or electrodes, and each of the resistor regions is connected to the emitter region corresponding thereto. In order to allow the conductor for connecting ...

A transistor is described which the base region comprises a submonolayer of essentially only dopant atoms. One embodiment is a GaAs/AlGaAs heterojunction bipolar transistor in which the base region comprises a submonolayer of Be atoms. The effective base transit time is negligible in these transistors.

A thin film field effect transistor and method for forming the same are disclosed. Conductive moat bodies 16 and 18 are formed on a surface 12 of an insulator substrate 10. A semiconductor channel layer 20 is formed covering the moat bodies 16 and 18 and the surface 12. A gate insulator layer 22 is formed covering the channel layer 20 between the moat bodies 16 and 18. A gate conductor 26 is formed outwardly from the gate insulator layer 22. Moat bodies 16 and 18 provide efficient contact points...

A high-power transistor in which the emitter is in the form of a grid adjoining a surface of a semiconductor body having collector and base regions, the latter surrounding the emitter. The apertures in the emitter grid form a plurality of juxtaposed rows with the base region. The surface of the semiconductor body is covered with an insulating layer which covers the line of intersection of the emitter base junction with the surface. Base and emitter contacts are provided on the insulating layer f...

There is provided a transistor, which includes a deoxyribonucleic acid molecule or a deoxyribonucleic acid molecule aggregate as a part of structural materials, has a source electrode member, a drain electrode member and a gate electrode member, in which at least one of three electrode members connects to the deoxyribonucleic acid molecule or deoxyribonucleic acid molecule aggregate. ##STR1##

A MOSFET is fabricated by forming a trench in a semiconductor substrate, forming an insulating film in the trench, forming a gate electrode to fill in the trench, forming a gate oxide on the gate electrode, the insulating film and an adjacent portion of the semiconductor substrate, forming a first silicon film on the semiconductor substrate and on a portion of the gate oxide, and forming a second silicon film on a portion of the gate oxide on which the first silicon film is not formed. Since the...

A withstand voltage region of a second conductivity type is formed in a drain layer of a first conductivity type in a semiconductor substrate, and a conductive region of the first conductivity type is partly formed in the withstand voltage region by being diffused from the surface of the withstand voltage region. The conductive region has a bottom held in contact with the drain layer. A base region and a source region are formed in the surface of semiconductor substrate, with a region between th...