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A photodiode array structure and method of fabrication is provided. The ay is fabricated on a substrate as a multilayer structure with a novel combination of different type layers and then separated into optically independent diodes by delineation of the diodes. A novel array with heterojunction diodes for far-infrared is specifically disclosed.
A gate array is disclosed having a plurality of basic cells each comprising a transistor whose gm is as low as one fifth to one twentieth that of the transistors in a conventional gate array. The low gm is provided by reducing the W/L ratio of the gate region of the transistor. The basic cell having the transistor of the low gm is formed to replace the conventional basic cell at a specified position in a specified basic cell array. The transistor of low gm reduces the number of basic cells neces...
An array of micromirror array lenses is invented. The micromirror array lens consists of many micromirrors and actuating components. Each micromirror array lens is variable focal length lens with high speed focal length change. The lens can have arbitrary type and/or size as desired and desired arbitrary optical axis and can correct aberration by controlling each micromirror independently. Independent control of each micromirror is possible by known microelectronics technologies. The actuating c...
In a method of fabricating an array of microstructures, a substrate with an electrically-conductive portion is provided, an insulating mask layer is formed on the electrically-conductive portion of the substrate, a plurality of openings are formed in the insulating mask layer to expose the electrically-conductive portion, and a first plated or electrodeposited layer is deposited in the openings and on the insulating mask layer by electroplating or electrodeposition. A second plated layer is furt...
A sensor array, usually a sensor matrix for sensing pressure, comprising a grid of conductors in a woven fabric, the row conductors crossing over the column conductors to form a matrix array of crossover points. The rows are separated from the columns by individually coating the conductors of one or both series with an electrically partially resistive fibrous material, so that when the conductors at any crossover point in the array are pressed closer together, the resistance between the two cond...
In a semiconductor array having a plastic casing and a cooling portion which is at least partly not embedded in the plastic, an insulating portion is provided which is designed to slide onto the cooling portion and to provide at least partial electrical insulation of the cooling portion when slid on.
An array lens comprises a member having a plurality of arranged openings, an elastic member provided in intimate contact with the member and having its surface shape deformable by an extraneous pressure, and means for imparting a force to the elastic member to deform the surface shape of the elastic member in the openings of the member.
An injection laser array has 2.sup.n output elements (1) coupled by Y couplers (2, 4, 6) and (n-1) in sets of intermediate elements to a single element (7) in a tree configuration. The face end of the single element is provided with a high reflectivity coating (8) while those of the 2.sup.n output elements are provided with low a reflectivity coating (9).
In a method of fabricating an array of microstructures, a substrate with an electrically-conductive portion is provided, an insulating mask layer is formed on the electrically-conductive portion of the substrate, a plurality of openings are formed in the insulating mask layer to expose the electrically-conductive portion, and a first plated or electrodeposited layer is deposited in the openings and on the insulating mask layer by electroplating or electrodeposition. A second plated layer is furt...
An improved seismic array is provided which has the capability to supply data to adjacent recording stations simultaneously. The seismic array has a plurality of seismic detector connection points, and a seismic detector is located at each seismic detector connection point. Dual weighting of the output of each seismic detector in thearray is achieved by connecting dual resistors to the output of each seismic detector. Two pairs of wires are also provided in the array, and one pair of wires inter...
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