A dielectric ceramic includes a compound represented by the general formula: (Ba.sub.1-tCa.sub.t).sub.m(Ti.sub.1-u-xZr.sub.uCu.sub.x)O.sub.3 (where 0.96.ltoreq.m.ltoreq.1.02, 0.001.ltoreq.x.ltoreq.0.03, 0.ltoreq.t.ltoreq.0.1, and 0.ltoreq.u.ltoreq.0.06) as a primary component, a rare earth element Re such as Dy, a metal element M such as Mn, Mg, and Si. In the dielectric ceramic, the Cu is uniformly and dispersedly present in the primary phase grain forming the primary component, and the content...

A method for manufacturing ceramic/metal or ceramic/ceramic composite articles is disclosed. The articles can be useful for the production of aluminum in fused salt electrolysis cells, as armor plates for the protection against projectiles, cutting tools, or in abrasion resistance applications. The temperature slope of the process if optimized such that one of the reactants in the manufacturing proceeds through peritectic decomposition at a heating rate of low temperature increase for desirably ...

The present invention provides a ceramic substrate for use in an apparatus for manufacturing and inspecting semiconductors. The ceramic substrate comprises a through-hole having excellent tolerance performance against a drawing stress applied to an external terminal pin. The through-hole is provided with a projection which protrudes into the ceramic substrate made of aluminum nitride as primary component.

A ceramic heater making it possible to prevent a short circuit in its resistance heating element and heat a semiconductor wafer evenly. The ceramic beater includes a ceramic substrate, an insulating layer having volume resistivity higher than that of the ceramic substrate, being formed on at least a part of the ceramic substrate, and a resistance heating element formed on the insulating layer.

A ceramic heater capable of reducing temperature uniformity at the periphery of through holes such as insertion holes and vacuum suction holes is provided, which protects wafer against thermal shocks and has improved controllability for temperature control parts such as thermocouples and temperature fuse. Further, a ceramic heater capable of uniform resin curing is provided. A heat generation body is disposed on the surface or inside of a ceramic substrate. Further, corners for the insertion hol...

The invention is to offer such a dielectric ceramic enabling to simultaneously sinter with the low resistant conductor of Ag based metals and Cu based metals, having the excellent mechanical strength and exhibiting the excellent dielectric characteristics in the GHz zone. Mixed powders of Si: 20 to 30 weight %, B: 5 to 30 weight %, Al: 20 to 30 weight %, Ca: 10 to 20 weight %, and Zn: 10 to 20 weight % are prepared, melted, and rapidly cooled to produce glass frits. The glass frits are granulate...

An object of the present invention is to provide a ceramic heater making it possible to suppress an outflow of heat to a supporting case and so on to make the temperature of its ceramic substrate uniform. The ceramic heater of the present invention is a ceramic heater wherein a heating element is arranged on a surface of a ceramic substrate or inside the ceramic substrate, the surface roughness Rmax of the side face of the ceramic substrate being from 0.1 to 200 .mu.m according to JIS B 0601.

An object of the present invention is to provide a ceramic heater making it possible to suppress an outflow of heat to a supporting case and so on to make the temperature of its ceramic substrate uniform. The ceramic heater of the present invention is a ceramic heater wherein a heating element is arranged on a surface of a ceramic substrate or inside the ceramic substrate, the surface roughness Rmax of the side face of the ceramic substrate being from 0.1 to 200 .mu.m according to JIS B 0601.

A ceramic heater improving a uniformity of temperature distribution in a work heating face, wherein a resistance heating body formed on a face of a ceramic substrate opposite to the work heating face thereof is such that the scattering of thickness is within .+-.50% of an average thickness, and a surface roughness of the resistance heating body is a range of 0.05-100 .mu.m as Rmax and not more than 50% of the average thickness.

A ceramic capacitor having an improved electrode soldering performance, little or no diffusion of solder even in the case of being used under a high temperature environment and a reduced characteristic deterioration is provided. The dry plating electrodes have a three-layer structure. First layers of the electrodes are respectively provided on both surfaces of a ceramic element assembly and made of any one or more of Cu, Ni--Cu alloy and Zn. Second layers of the electrodes are respectively provi...