Ceramic electrode is brazed to compliant support, a plurality of curved metal strips mounted on edge, opposite edges being brazed to cooling block. Compliance permits expansion and distortion of electrode when heated without development of stress damaging to brazed joints or to electrode.

Beam lead semiconductor devices are loaded onto an apertured compliant-bonding tape and held thereto with a releasable adhesive. The apertured tape is successively indexed through a loading machine. At one station, small accurately located dots of adhesive are applied to the tape. At a transfer station, integrated-circuit chips are pressed against the tape so that beam leads are secured to the dots of adhesive. Integrated-circuit chips are brought to the transfer station in spring-biased holding...

A compliant bonder has a single heated tip which is raised and lowered along a bonding axis. The tip is surrounded by a turret which indexes successive portions of a continuous compliant member across the bonding axis. The turret is provided with a series of holes through a rim portion thereof. In order to index the compliant member, after a bond is completed, the turret is lowered to disengage the bonding tip from the hole in the turret. The turret is then rotated to bring the next successive o...

A compliant electrical connector has a pin with opposed convex surfaces to grip the boundary of a hole, the pin having at least one groove sunk in the side thereof so that the pin forms a flexure that flexes to reduce the cross sectional area of the groove as the pin is inserted into the hole.

A member has a compliancy which changes at elevated temperatures. The member is useful as a fuser member such as a fuser roller for applying heat and pressure to a toner image carried by a receiver to fuse the image without introducing fuser-related image defects. The fuser member includes an elastomeric material incorporating particles of a material which is solid at ambient temperatures but which becomes fluid at fusing temperatures, thus making the elastomeric material more compliant.

The dimensions of the compliant segment of a compliant pin are carefully controlled, so that upon being inserted into a hole in a circuit board the pin fits snug within the hole, but avoids the use of excessive force which could damage the copper sheathing of the hole. Prior to the pin being inserted into the hole, the compliant segment, which comprises a pair of beam members separated by an opening, has a width measured across its widest part that exceeds the maximum acceptable hole diameter by...

Beam lead semiconductor devices are loaded onto an apertured compliant-bonding tape and held thereto with a releasable adhesive. The apertured tape is successively indexed through a loading machine. At one station, small accurately located dots of adhesive are applied to the tape. At a transfer station, integrated-circuit chips are pressed against the tape so that beam leads are secured to the dots of adhesive. Integrated-circuit chips are brought to the transfer station in spring-biased holding...

An open celled mensesphilic polyurethane foam tampon having a transverse periphery large enough to substantially coincide with the periphery of the vagina and a shape modulus of compression which allows it to be deformed by the vertical pressures exerted by the vagina whereby the tampon spreads laterally to more completely establish contact with the walls of the vagina, and having a material modulus of compression such that surface irregularities on the vaginal wall compress the tampon slightly ...

A compliant bonder has a single heated tip which is raised and lowered along a bonding axis. The tip is surrounded by a turret which indexes successive portions of a continuous compliant member across the bonding axis. The turret is provided with a series of holes through a rim portion thereof. In order to index the compliant member, after a bond is completed, the turret is lowered to disengage the bonding tip from the hole in the turret. The turret is then rotated to bring the next successive o...

Beam lead semiconductor devices are loaded onto an apertured compliant-bonding tape and held thereto with a releasable adhesive. The apertured tape is successively indexed through a loading machine. At one station, small accurately located dots of adhesive are applied to the tape. At a transfer station, integrated-circuit chips are pressed against the tape so that beam leads are secured to the dots of adhesive. Integrated-circuit chips are brought to the transfer station in spring-biased holding...