Apparatus for preparing extrudable food products prior to cooking includes depositing portions of food product onto a horizontal surface, coating the food portions with flour, vacuuming away excess flour, and incrementally flattening the food portions to a desired thickness. An apparatus for performing this process includes a first flour depositor, a food depositor, a second flour depositor, and a food flattener, all mounted above a conveyor belt. The conveyor belt is mounted atop a supporting c...

An apparatus for depositing materials on a substrate includes a manifold having a plurality of inlet valves located equidistantly from the manifold outlet. Preferably the inlet valves are mounted in radial configuration to minimize any "dead space" between the valves and the manifold outlet. The manifold connects a plurality of gas sources through its inlets to a process chamber at its outlet. The valves within the manifold switch continuous reactive gas flows from the sources back and forth bet...

A liquid depositing tip is removably mounted on a tip mounting portion formed on one end of a tip support arm mounted for up-and-down movement. A suction-and-discharge mechanism is operatively connected to the liquid depositing tip by way of the tip support arm to suck sample liquid into the depositing tip and to discharge the sucked sample liquid from the depositing tip onto a chemical assay slide. The quantity of the sample liquid to be sucked into the tip and to be discharged therefrom is con...

An apparatus for depositing droplets on a substrate is disclosed. The apparatus includes a support for the substrate, a droplet ejection assembly which includes a pumping chamber, a controller and a source of static pressure to maintain the total pressure in the pumping chamber above a threshold pressure level to avoid rectified diffusion type bubble growth in the pumping chamber. The droplet ejection assembly is positioned over the support for depositing the droplets on the substrate and includ...

A bill depositing/dispensing apparatus being fitted with a plurality of storing boxes for storing bills including a deposited bill box, an outgoing bill box, a recycle box, and an acceptance box with multi-compartments for sorted storing of bills. The acceptance box has a fitting mechanism common to at least one of a fitting mechanism of the deposited bill box, the outgoing bill box and the recycle box, and has a slot in a same position to at least one of the deposited bill box, the outgoing bil...

An apparatus for depositing droplets on a substrate, the apparatus includes a support for the substrate, a droplet ejection assembly positioned over the support for depositing the droplets on the substrate on the support, an enclosure structure defining with the support an enclosed region through which the droplets are ejected onto the substrate, the enclosure structure also defining with the support an inlet gap and an outlet gap through which the substrate travels and a source of pressurized g...

A sheet depositing device for depositing sheets or sets of sheets fed sequentially from a paper processing apparatus onto a depositing platform and against a depositing registration barrier, the sheet depositing device including a sheet catcher adapted to rest on said depositing platform or adapted to rest on sheets stacked on the depositing platform, the sheet catcher being movable in a direction substantially perpendicular to the depositing platform and engaging the leading edge of incoming sh...

The invention relates to a device comprising a process chamber which is arranged in a reaction housing and which can be heated especially by supplying heat to a substrate holder, comprising a gas inlet for the admission of gaseous starting material, whereby the decomposition products thereof are deposited on a substrate maintained by a substrate holder to form a layer, also comprising at least one sensor acting upon the inside of the process chamber for determining layer properties further compr...

An apparatus for depositing droplets on a substrate is disclosed. The apparatus includes a support for the substrate, a droplet ejection assembly which includes a pumping chamber, a controller and a source of static pressure to maintain the total pressure in the pumping chamber above a threshold pressure level to avoid rectified diffusion type bubble growth in the pumping chamber. The droplet ejection assembly is positioned over the support for depositing the droplets on the substrate and includ...

This invention relates to a method of depositing dielectric on a semiconductor substrate to form part of a capacitor. The method includes reactive sputtering a metal oxide layer from a target of metal onto the substrate wherein the support is biased to induce a DC voltage across the depositing dielectric as it forms. The voltage may be in the range of 200-300V.