A solution for electrochemical metallization of dielectrics comprising a salt of copper, a phosphorus-containing salt, a stabilizing agent and water which contains, as the phosphorus-containing salt, a salt of hypophosphorous acid, the components being employed in the following proportions, g/l: copper salt: 35 to 350 hypophosphorous acid salt: 35 to 400 stabilizing agent: 0.004 to 250 water: up to 1 liter. A process for electrochemical metallization of dielectrics involving preparation of the d...