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A lightweight armor system for defense against a high explosive incendiary rojectile characterized by a lightweight armor trigger plate placed in front of and spaced from a relatively heavier main armor. The trigger plate may consist of a ceramic-fiberglass sandwich and the main armor a one half inch thickness of aluminum backed by a built-up layer of ballistic nylon webbing and sealed by a layer of rubber sheeting. The space between the trigger plate and the main armor may be filled with a mate...
Elongate copper bodies, such as rods and wires, of electric conductor grade are made by electrodepositing copper as brittle cathodes which are then broken into fragments and fed as such to a continuously-acting friction-effected extrusion machine (such as Conform or Linex) which consolidates, bonds and extrudes them. The fragments have a specific surface area of about 25 - 1000 mm.sup.2 /g, and they are not subjected to any high-temperature purification or grain growth step prior to extrusion, t...
A method of bonding a laminated porous sheath to a cast strut includes the step of performing a compressible pad to have a plurality of closely spaced grooves on one surface thereon and a plurality of spaced apart lands on the opposite face thereof; locating a preformed porous laminate sheath over the outer surface of a cast strut and laser welding it thereto and thereafter assembling the preformed compressible pad to locate the plurality of grooves thereon in overlying relationship to a plurali...
A fabricating method for a system that includes a plurality of processing apparatuses connected to each other by an inter-apparatus transporter and a computer storing managing information of processing and transporting of semiconductor wafers. The processing apparatuses have an interface for loading and unloading a plurality of the semiconductor wafers that are contained in a carrier. The semiconductor waters are processed in processing chambers of the processing apparatuses and the result of pr...
A process for producing an article of glass manufacture is disclosed in which oxide dispersion strengthened alloys are used to produce complicated shapes. The process includes a critical thermomechanical processing sequence to recrystallize the alloy into a coarse grain structure for high temperature service.
Disclosed is a fabricating system including a plurality of processing apparatuses connected to each other by means of an inter-apparatus transporter, wherein one group of semiconductor wafers are processed in processing apparatuses and other group of wafers are transported to specified processing apparatuses for a time interval from (To+T) to a time To; and another group of wafers are processed and the remaining group of wafers are transported for a time interval from (To+T) to (To+2T). Since pr...
Disclosed is a fabricating system including a plurality of processing apparatuses connected to each other by means of an inter-apparatus transporter, wherein one group of semiconductor wafers are processed in processing apparatuses and other group of wafers are transported to specified processing apparatuses for a time interval from (To+T) to a time To; and another group of wafers are processed and the remaining group of wafers are transported for a time interval from (To+T) to (To+2T). Since pr...
Melt fabrication, with precompounding, of a plurality of thermoplastic resins, is provided by use of a screw having a dispersion section in such machines as injection molding machines. The minor resin component can be an elastomer, which toughens the resin's major component. This effect is improved by increasing back pressure on the screw used in the injection molding machine, to extend the screw rotation and thus shear time accomplished by the dispersion section.
A fabricating method for a system including a plurality of processing apparatuses connected to each other by an inter-apparatus transporter. The semiconductor waters are processed in the processing apparatuses and are transported to specified processing apparatuses in different time interval that are set to N times a unit time interval. Since the fabricating system includes processing apparatuses and an inter-apparatus transporter that are periodically controlled at time intervals related to a u...
A fabricating method for a system that includes a plurality of processing apparatuses connected to each other by an inter-apparatus transporter and a computer storing managing information of processing and transporting of semiconductor wafers. The processing apparatuses have an interface for loading and unloading a plurality of the semiconductor wafers that are contained in a carrier. The semiconductor waters are processed in processing chambers of the processing apparatuses and the result of pr...
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