A process and an architecture related to a vertical MOSFET device and a capacitor for use in integrated circuits. The integrated circuit structure includes a semiconductor layer with a major surface and further including a first doped region formed in the surface. A second doped region of a different conductivity type than the first doped region is positioned over the first region. A third doped region of a different conductivity type than the second region is positioned over the second region. ...

The disclosure is directed to a laser target structure and its method of fabrication. The target structure comprises a target plate containing an orifice across which a pair of crosshairs are affixed. A microsphere is affixed to the crosshairs and enclosed by at least one hollow shell comprising two hemispheres attached together and to the crosshairs so that the microsphere is juxtapositioned at the center of the shell.

This disclosure relates to a system and method for creating nanowires. A nanowire can be created by exposing layers of material in a superlattice and dissolving and transferring material from edges of the exposed layers onto a substrate. The nanowire can also be created by exposing layers of material in a superlattice and depositing material onto edges of the exposed layers.

A method, apparatus, and computer program, for fabricating multiple arrays arranged successively in a first direction on a substrate and each having multiple feature sets arranged successively in the first direction within the array. The method uses a head system having multiple successive sets of dispensers. In the method, the head system is advanced in the first direction over the substrate while dispensing drop sets for each array from dispenser sets so as to form the arrays. In one aspect, d...

The fabrication of a resistor structure is described. A resistive region is formed over the top of a substrate. Trenches are formed from the top side of the substrate in scribe line regions where the wafer is to be separated to form resistor modules. Contact layers are formed over the top side of the substrate and are electrically coupled to each end of the resistive region, respectively. The contact layers are also formed over the sidewalls of the trenches. The wafer is separated through the tr...

A method of forming a circuit includes forming a metallic circuit pattern on a base substrate. The circuit pattern has traces which are connected together by temporary bussing. A resist pattern for defining at least one terminal pad is formed over the circuit pattern. A layer of metal is formed on at least one area of the circuit pattern exposed by the resist pattern to a thickness suitable for serving as the at least one terminal pad for the circuit. A portion of the base substrate at the locat...

A collimator that formed from a plurality of metal layers that are shaped by use of lithographic techniques in specific shapes. The formed metal layers are stacked and aligned together and then connected together to form the collimator.

A method for forming a multilevel structure on a surface by depositing a curable liquid layer on the surface; pressing a stamp having a multilevel pattern therein into the liquid layer to produce in the liquid layer a multilevel structure defined by the pattern; and, curing the liquid layer to produce a solid layer having the multilevel structure therein. Mechanical alignment may be employed to enhance optical alignment of the stamp relative to the substrate via spaced protrusions on the substra...

A method of fabricating an array with multiple sets of neighboring features. In the method, for each of multiple sets of neighboring features, at least one set of drops is deposited from a corresponding same pulse jet dispenser onto a substrate so as to form the array with the sets formed from drops deposited by respective different dispensers. Apparatus and computer program products which can execute a method of the invention, are also provided.

A method, apparatus, and computer program, for fabricating multiple arrays arranged successively in a first direction on a substrate and each having multiple feature sets arranged successively in the first direction within the array. The method uses a head system having multiple successive sets of dispensers. In the method, the head system is advanced in the first direction over the substrate while dispensing drop sets for each array from dispenser sets so as to form the arrays. In one aspect, d...