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In liquid crystal devices employing twisted nematic materials, surfaces of the device enclosure are provided with oriented microstructures along which the molecules of the liquid crystal material are aligned. The microstructures are provided by techniques allowing heating thereof to elevated temperatures without loss of the molecular aligning characteristic, and a liquid crystal material is hermetically encapsulated within the device enclosure by means of a fused joint provided at an elevated te...
A semiconductor material of a first conductivity type has one of its surfaces subjected to high energy oxygen ion implantation, thereby forming an oxide layer below that surface. A gate is formed by masking at least a portion of the surface, exposing the unmasked portion to ion radiation so as to implant impurity ions in the region of the semiconductor material between its unmasked surface and the upper side of the subsurface oxide layer, and metallizing the surface above the implanted region. A...
A method for fabrication of a lateral transistor is disclosed, which comprises the step of diffusing base impurity by means of the RED method from the same masking hole determining an emitter region on a substrate which includes the emitter region and a collector region on the crystalline main plane thereof.
A process is provided for the manufacture of simulated wooden channel, or box, beams. The beams manufactured in accordance with the process of the invention may be composed, for example, entirely of polyurethane plastic; or they may be constructed to consist of a polystyrene or honeycomb paper inner core with a continuous molded thin skin of polyurethane. The channel beam provided in accordance with the process of the invention has a hollow rectangular cross-section, and it has relatively thin s...
Glass workpieces having a conductive material film on one surface, for eventual use as substrates between which a liquid crystal material is contained, are treated to remove or deplete various impurities from a thin region within the substrates at the one surface.
Elements of a roof truss, including top and bottom chord members, web members, and barbed connector plates, are assembled into truss configuration. The steps of the method include: A. locating the chord members and web members in truss configuration, with the web members located between the chord members, B. locating said plates at opposite sides of the truss in overlapping relation to joints between the chord and web members, C. relatively clamping the chord members toward one another and towar...
A technique for the fabrication of thin film electrets suitable for transducer applications is described. The technique involves irradiating a perfluorinated polymer foil with an electron beam, depositing gold upon the irradiated polymer charging the metallized film and baking the resultant structure. The described technique results in only limited and reversible damage to the charge storage properties of the polymer which is in marked contrast with prior art processes.
The unidirectional solidification of a metal-ceramic composite in a system omprising the positioning of a seed crystal in a crucible, adding a portion of premelted ceramic material, a metallic material, and the remainder of the premelted ceramic. The temperature of the ceramic material is raised to about 50.degree.C above its melting point and then slowly decreased with a corresponding increase in the flow of an inert coolant gas through the system thereby unidirectionally solidifying the materi...
A photon sensitive film resistor is provided having a resistance measured megohms per centimeter. The method of fabrication insures that the resistance is uniformly distributed along the current path.
A process for the high volume fabrication of planar electrical circuits having precision electrical characteristics and especially adapted for use in electronic security systems employing resonant circuits. A multiplicity of circuits are formed by high speed printing techniques on opposite surfaces of an insulative web and the individual circuits separated for use.
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