A handling device is proposed, in particular for handling boards and foils, with a number of suction grippers located in a plane. A suction plate (10) is provided which is made of a porous material or sintered material and a suction pressure can be applied to said suction plate, where said suction plate is equipped with openings (19) permitting passage of the suction grippers (18). In addition, positioning means (23) are provided so that in a first position setting, the suction grippers (18) ext...

A rail-borne handling machine for handling containers and bulk materials in seaports and inland harbors includes a framework for carrying load bearing means and includes gantry supports arranged on the framework. Rail-based traveling gears are connected to the gantry supports of the framework via articulated connections for supporting the framework on rails. Balancers connected to the gantry supports via articulated connections and at least four steerable tire-based traveling gears are connected...

A handling apparatus for handling cables includes first and second members connected together for relative movement between an open position in which a cable may be inserted between the members, and a closed position in which the cable is securely held between the members with a part of the cable projecting outwardly of the members, to enable the first and second members to be held whilst work operations are carried out on the projecting part, the apparatus further including an elongate indicati...

The present invention relates to media handling devices and media handling methods. One aspect of the invention provides a media handling method including providing a media handling device having an initial media path; selectively moving a guide member using a motor intermediate a first position where the guide member is spaced from media within the initial media path and a second position where the guide member contacts the media within the initial media path; applying a control signal to the m...

A handling apparatus includes a main unit, a holder configured to hold an object, a retainer configured to retain the holder so as to allow the holder to displace with respect to the main unit, and a latch unit configured to selectively bring the holder into a latched state, in which the displacement of the holder with respect to the main unit is restrained, or an unlatched state, in which the displacement of the holder with respect to the main unit is not restrained.

A wafer holder has a set of minimum contact wafer support members predefining support member contacting portions on a planar wafer surface of a wafer. The wafer chuck has a wafer support region for contacting the planar wafer surface. The wafer support region of the chuck includes recesses configured at predefined positions corresponding to support member contacting portions of the lower wafer surface. The wafer handling system further includes a wafer transport device including a rotational pos...

A frame handling system and frame handling method therefor which is capable of speedily handling the frames appropriately according to the type of lines, requiring a minimum function/circuit involvement. this invention is composed of a cell segmentation and reassembler (SAR) portion and a frame handling portion, wherein SAR portion receives a stream of ATM cells from lines VC1 to VCn, separates ATM cells depending on whether they come from VP or VC connections, and assembles them into AAL5 frame...

Object management in a distributed system includes at least one attribute information management server for managing attribute information of the object in correspondence with identification information given to the object, at least one identification information management server for managing the attribute information management server in correspondence with the identification information, and at least one supporting server for supporting handling of the object in accordance with the attribute ...

There is provided an apparatus for handling a disklike member having a surface, especially for handling of a wafer, including a robot for carrying out at least an angular motion in a defined moving plane, an end-effector for holding the disklike member, and a wrist member operatively interconnecting said robot with said end-effector. The wrist member provides at least a motion of the end-effector about an axis in a plane of the surface of the disklike member. An inclining motion of said disklike...

The object of this invention relates to the technical sector of microelectronics. The vacuum handling system according to the invention comprises a hollow body (1) of which the end takes the gripping tip forming an inside chamber (1b) with at least two annular grooves (1b1) and (1b2) for the positioning of two O rings (7) of a soft deformable material to insure, on the one hand the dismantable assembling of the part corresponding to the tip, and, on the other hand, the vacuum tightness.