The invention provides a heat sink for cooling and electronic device. The heat sink includes a member, and a heat pipe secured to the member. The member has a first portion, a second portion, and a plurality of fins on the second portion. The heat pipe has a first, evaporator section and a second, condenser section. The first section is located at the first portion so that heat can be transferred thereto from a heat generating component of the electronic device. The second section is located at ...

A heating system of the heat pump type is disclosed in which the outside coil, employed to reject heat in air conditioning mode or to absorb heat in heating mode, is supplied with heat independently of that provided by ambient air when the efficiency of the system falls off due to low ambient air temperature. The amount of heat thus supplied is controlled to increase the efficiency of the system sufficiently to produce a significant net decrease in operating cost. In a conventional system, the o...

An improved heat sink device for transferring heat from a heat generator to lower-temperature surroundings comprising a device-embedded compound that absorbs heat, delaying temperature rise in the heat generator, at a specific temperature by melting or entering into an endothermic chemical change or reaction and which is absorbed and retained within the device by a mesh or fabric of a multiplicity of fibers.

Being a heat pipe heat exchanger wherein a group of heat pipes are arranged in box form and the central part thereof is partitioned, a high temperature fluid being let to flow into one and a low temperature fluid into the other one, respectively, so that, by the specific properties of the heat pipes, the heat given from the high temperature fluid is transferred to the low temperature fluid through the sealed-in fluid in the heat pipes, a plurality of heat pipes of which those on at least the hig...

A heating system of the heat pump type is disclosed in which the outside coil, employed to reject heat in air conditioning mode or to absorb heat in heating mode, is supplied with heat independently of that provided by ambient air when the efficiency of the system falls off due to low ambient air temperature. The amount of heat thus supplied is controlled to increase the efficiency of the system sufficiently to produce a significant net decrease in operating cost. In a conventional system, the o...

This disclosure relates to a heat exchanger which includes an A-coil through which a heat-exchange medium (refrigerant) is circulated between an inlet and an outlet thereof, a compressor in fluid communication with the outlet for compressing a vapor phase of the heat-exchange medium, and means for generating heat beyond and as an augment to ambient temperature sufficient to transform the liquid phase of the heat-exchange medium to its vapor phase during the passage of the heat-exchange medium fr...

Storage of energy is desirable for many purposes, such as heat energy produced by sunshine or by conventional energy sources during periods of off-peak demand. In the present case, heat energy is brought into a storage area by way of a "pillow" or quilted blanket-like device that has large storage space within itself and which, in addition, serves as a large heat-exchanger to impart its heat to other storage material within a container. The "pillow" or quilted blanket-like device is generally us...

This invention relates to a heat reclaiming device for a heat pump. The heat reclaimer is able to absorb heat from the compressor by circulating cooling fluid through a circuit which is mounted in good heat transfer relationship with the condenser, then around the shell of the motor-compressor and lastly around the hollow tube which connects the condenser to the compressor. The reclaiming circuit is connected into a fluid circulating loop which is used to supply heat to the evaporator coil of th...

A heat dissipation device is used for removing heat from at least two adjacent first and second electronic devices in a computer enclosure. The heat dissipation device includes a first heat sink mounted on the first electronic device and a second heat sink mounted on the second electronic device. The first heat sink includes a base, a first fin unit mounted on the base and two heat pipes extending from the base outwardly. Second and third fin units engage with the two heat pipes, respectively. T...

A heat dissipation device includes a fin assembly, a base, a heat pipe soldered with the base, and a heat spreader sandwiched between the heat pipe and the fin assembly. The fin assembly has a bottom face. The base has a bottom surface and a top surface. The heat pipe comprises an evaporation portion thermally engaging with the top surface of the base plate and a curved portion extending from the evaporation portion and projecting beyond the base plate. The heat spreader has a first face engagin...