Triazine polymers obtained by reacting (a) monocyanate; and (b) dicyanate and/or prepolymers thereof are used in forming interconnection structures for bonding an integrated semiconductor device to a carrier substrate.

Interconnection unit (1) for transferring signals between board connectors P1, . . . , Pn for receiving printed circuit boards, situated on the front part of the interconnection unit, and cable connectors C1, . . . , Cm for receiving cables. The cable connectors C1, . . . , Cm are located on the upper front part and on the lower front part of the interconnection unit (1), such that the board connector P1, . . . , Pn are located in the central part of the interconnection unit (1). Thus, the board...

A spring system arrangement and a related connector are disclosed. The purpose is to allow the use of contact springs, such as coil contact springs, with relatively large size body, to be located on a small center distance, i.e. pitch, and to electrically connect with contact pads of high density electronic devices, having a small device pitch. The device pitch can be smaller than the diameter of the spring body itself. In order to achieve this desired small spring pitch and high density, the co...

In a metal film production apparatus, a copper plate member is etched with a Cl.sub.2 gas plasma within a chamber to form a precursor comprising a Cu component and a Cl.sub.2 gas; and the temperatures of the copper plate member and a substrate and a difference between their temperatures are controlled as predetermined, to deposit the Cu component of the precursor on the substrate, thereby forming a film of Cu. In this apparatus, Cl* is formed in an excitation chamber of a passage communicating w...

A multiconductor snake wiring system which uses a flexible bus structure with taps for providing connections to the components is disclosed. An automated facility for manufacturing the snake wiring system is also described. A compact multilayer wiring structure for connecting the components and a unique process for manufacturing the wiring structure are also disclosed.

A cable connector having improved strain relief and cable retention qualities disclosed. A separate strain relief member includes a ferrule or anvil. This member is placed on a cable. The connector is then assembled and the shields are then attached to the connector parts, including the strain relief member. Latches are provided on a connector that mates with the cable connector. The latches engage the strain relief directly. In one embodiment, the latches engage lugs formed on the strain relief...

An RF microcircuit package and interconnection device is disclosed which minimizes impedance mismatch between circuit elements. Multiple signal vie and close proximity ground vies as well as tuned wire bonds are disclosed.

An electrical interconnection arrangement includes a cable laminate adapted to receive a plurality of twinaxial cables; an interposer including a plurality of spring contacts; wherein the interposer has a first side adapted to mate with the cable laminate and electrically connect the plurality of spring contacts to one and of the plurality of twinaxial cables; and wherein the interposer has a second side adapted to mate with a PC board and electrically connect the plurality of spring contacts to...

A signal processing system includes a control processor that has a bi-directional port, signal processors that each have a serial port, a bridge that has serial ports each operatively connected to a serial port of one of the signal processors, and a bi-directional port operatively connected to the bi-directional port of the control processor.

A conductor for interconnecting integrated circuit components having improved reliability. The conductor includes a liner surrounding at least three surfaces of the conductor, producing a low textured conductor. It has been found that low textured conductor results in improved electromigration lifetime.