An interconnection system includes spacers arranged adjacent each other in a row, the spacers having cable sections disposed therein. Each cable section has at least one center conductor and an outer conductive shield. All of the cable sections have one end exposed on a first plane and a second end exposed on a second plane. Electrically conductive contacts are disposed within apertures in a pair of interposers so as to have one end making electrical contact with one of the cable sections and an...

An exemplary embodiment of the invention is an interconnection system including a primary connector having a first detection contact coupled to a first voltage, a second detection contact coupled to said first voltage and a reference contact coupled to a second voltage. The interconnection system includes a secondary connector having a first contact, a second contact and a secondary reference contact. The second contact and secondary reference contact are electrically connected. The first contac...

Disclosed is an integral connector unit for use primarily as a network interface. The unit combines a connection to customer premises equipment either in the form of screws or self-strip terminals, an RJ11 plug, and a strain relief member for the plug. Latching means are also included for snapping the circuit into the chassis of a terminal housing.

For example, a surface emitting semiconductor laser and a driver IC are arranged three-dimensionally to put a submounting substrate between them, and LSIs such as a CPU, etc. are mounted on the driver IC. The surface emitting semiconductor laser is formed of the epitaxial lift-off (ELO) process and has a thickness of about 10 .mu.m. A through hole is provided to all the submounting substrate, the surface emitting semiconductor laser, the driver IC, and the LSIs. These parts are connected electri...

Processes for fabricating electrochemical interconnections between semiconductor chip pads and substrate pads. First, pads on a substrate are electrically shorted by depositing a film of conductive metal, conductive bumps are created on the substrate pads, and the pads on the substrate are aligned with pads on a semiconductor chip. Then, by electrochemically depositing metal to the bumps, electrical interconnections are formed between the semiconductor chips pads and the substrate pads. Finally,...

An interconnection element for use in an user-configurable interconnection technology includes a normally shorted fuse element and a normally open antifuse element connected in series. The antifuse element is designed to program at a first current at a selected programming voltage. The fuse element is designed to program at a second current which exceeds the first current by a margin sufficient to prevent inadvertent programming of fuse elements during the antifuse element programming cycle. An ...

An interconnection system for interconnecting a plurality of planar electronic circuit boards each of the circuit boards including a plurality of contact portions for providing electrical coupling, the system including a support sheet disposed between each pair of planar electronic circuit boards; a plurality of coupling elements disposed in each support sheet, electrically insulated from the other coupling elements on that support sheet, and aligned with the contact portions on the adjacent pla...

A three dimensional micro electronic module packaged for reduced signal propagation delay times includes a plurality of circuit carrying means, which may comprise unbacked chips, with integrated superconductive circuitry thereon. The circuit carrying means are supported on their edges and have contact lands in the vicinity of, or at, the edges to provide for interconnecting circuitry. The circuit carrying means are supported by supporting means which include slots to provide a path for interconn...

An interconnection of a structure comprising a modular assembly and a substructure supporting it. The assembly consisting of several stories is composed of a plurality of self-supporting modules, each having the form of a rectangular tube. Modules are assembled in a "stack-bond" fashion, overlapping one another on adjacent sides fully, or partially. The vertical interconnection of the structure is secured typically by rods threaded at bottom, at top provided with a nut head or expanded into the ...

A seal for use between an annular combustor and a turbine nozzle, disposed downstream of the combustor, is provided with means for effectively innerconnecting the combustor with a sidewall surrounding the nozzle. The sidewall includes an upstream extending radially projecting flange and the combustor includes an axially projecting downstream extending flange. The seal includes means for frictionally engaging each of these flanges and retaining them in a sealing relationship while permitting axia...