The construction of complex electrical circuits is simplified by performing all interconnections on one side of a component-receiving board, using slotted beam insulation-piercing connectors. Boards with or without metallization patterns are adaptable to the basic approach. Using boards with an X-Y pattern of holes arranged in columns, slotted beam connector elements are readily pressed into one side; and corresponding circuit elements such as dual-in-line packs plugged from the other side into ...

A method and apparatus for interconnecting one or more groups of primary electric cells in which cells in each group are further divided into two series-connected subgroups which, in twin, are connected to a three-conductor transmission system having a positive, a negtive and a neutral or return conductor. One subgroup of each group is connected between the negative terminal and the neutral and the other subgroup is connected between the positive terminal and the neutral such that the line to li...

A circuit board interconnection system comprising an edge mounted electrical connector and at least one cable connector. The edge mounted connector comprises a body having a plurality of electrical contacts retained thereon with each contact including a circuit board engaging portion and a terminal engaging portion. At least one receptacle is formed by a flange extending from the body about the terminal engaging portions. The cable connector comprises a body including a pluraity of terminals the...

A signal communicator for transmitting an electrical signal from one member rotating relative to another member is in the configuration of a journal bearing and comprises at least one conically shaped annular graphite ring supported by inner and outer electrically conductive races. While one race is insulatively mounted on the rotating member and electrically connected to a condition sensor, the other race is insulatively mounted on the relatively stationary member and electrically connected to ...

This specification describes the testing of interconnections between modules mounted on a card and between the modules and the input and output terminals of the card. Each of the modules has an Exclusive-OR circuit which receives an input from each of the input pins of the module and has a single output which is taken off an output pin of the module. Also, each of the modules has a test input circuit for accessing all of the output pins of the module in parallel from a single input terminal. The...

An interconnection substrate for electrical circuits comprising a plurality of planar conductive metallized patterns disposed between alternating layers of a dielectric medium, and substantially normal thereto electrically conductive paths extending between at least some of said conductive metallized patterns. Diffused metallurgical bond interfaces provide mechanical and electrical connection between the conductive metallized patterns and paths.

For interconnecting or joining two craft, one of which having an end cavity for accomodating one end of the other craft, having the function of a pusher, the end of the second craft is made to rest one the bottom of the cavity in the first, a watertight sealing is formed between the two coupled craft and the residual water is drained out of said cavity for an increased adherence between the two craft and so as to obtain a joining such as that the astern portion does not feel the effects of the e...

An interconnection system circuit integrated on the same substrate comprises: ohmic contacts made by a layer of zirconium or tantalum which ensures resistive contact and overlaid with a layer of aluminum. The interconnections are effected by two superimposed layers of zirconium or tantalum and of aluminium and the resistors are made by the exposed zirconium or tantalum.

A method of manufacturing an interconnection substrate, includes the steps of forming the first and second conductor layers of metals which have good ohmic contact and bonding properties on a substrate and each of which can be etched without corroding the other. A thin part of the upper surface of the second metal conductor layer is oxidized to form a porous film and a photoresist film having predetermined pattern is formed on the porous film. Those parts of the porous film and the second layer ...

An interconnection pattern involving crossover of conductive paths is provided by a process which involves forming the first conductive pattern by depositing a continuous layer of a conductive material which is convertible in situ to an insulator and, after masking to define the desired first conductive pattern, converting the rest of the layer to an insulator. Then after providing an insulating layer over the first conductive pattern the second conductive pattern is formed over the first conduc...