This invention pertains to product and process. The product is a transparent product of a density in excess 99.5% comprising spinel and having uniform mechanical properties. The process pertains to fabrication of a transparent spinel product comprising the steps of dissolving a sintering aid in water to form a neutral sintering aid solution, adding a suitable additive to the sintering aid solution, applying the sintering aid solution to spinel particles to form a spinel dispersion, sub-dividing ...

Disclosed herein is an optical article having a top layer with a structured surface that collimates light, a core layer secured to the top layer opposite the structured surface, and a bottom layer secured to the core layer opposite the top layer. Either the top layer or the core layer includes a first extrudable polymer having a flexural modulus of greater than 2.5 GPa, and the other layer includes a second extrudable polymer having a flexural modulus of 2.5 GPa or less, an impact strength of gr...

An apparatus for converting expended thermoplastic material, specifically empty plastic bottles, into artificial rocks, by placing the empty thermoplastic bottle in the apparatus between two sliding carriages, on each of which a rock has been mounted; and each carriage attached to a hydraulic jack, which, when the handle is pumped, moves the carriage toward the bottle which has been heated to malleability by heat lamps mounted above and sideways to the bottle, and the said heated, flexible bottl...

A stent has surface sculpturing, preferably on its outer surface only, having, for example, microspheres, having the function of increasing the actual geometric surface area of the stent, of creating undercuts and roughness to encourage the application of coatings of active or activatable agents, as well as of improving the attachment of the stent to the blood vessel wall.

A method of producing a capacitor that includes producing a first electrode having a first surface; forming a recess in an element, walls of the element and the first surface of the first electrode defining the recess, the element having a first surface exterior of the recess; forming a dielectric layer on the element, the dielectric layer oriented against the first surface of the element and against the walls of the element within the recess; polishing off at least a portion of the dielectric l...

A method of making the circuitized substrate. The circuitized substrate includes a substrate having a substantially planar upper surface and a conductive layer positioned on the substantially planar upper surface. The conductive layer includes at least one side wall therein, defining an opening in the conductive layer. The conductive layer includes an end portion spaced from the opening, the end portion forming an acute angle with the substantially planar upper surface of the substrate. The at l...

A dual filter apparatus and a process of making a dual filter apparatus that minimizes disruption to the normal flow pattern through the filter apparatus by forming a porous medium suitable to carry a fluid activator and placing an activator proximate the porous filter medium for in situ fluid treatment and removal of debris from the fluid by screening action of the porous filter medium that entraps debris thereon.

A method of making steel in an electric arc furnace is provided. The method comprises the steps of charging a steelmaking furnace with an iron source, wherein the iron source is melted and refined in the steelmaking furnace during a campaign, providing a source of lime that is screened by a first screening device, compacting the lime material adjacent to the steelmaking furnace to a predetermined size, charging the compacted lime to the steelmaking furnace within a short period of time to avoid ...

A method of depositing noble metals on a metal hexaboride support. The hexaboride support is sufficiently electropositive to allow noble metals to deposit spontaneously from solutions containing ionic species of such metals onto the support. The method permits the deposition of metallic films of controlled thickness and particle size at room temperature without using separate reducing agents. Composite materials comprising noble metal films deposited on such metal hexaborides are also described....

A method for manufacturing a semiconductor device that includes a housing, formed of a polyamide-series thermoplastic resin, and a semiconductor package sealed in the housing, which is formed of a thermosetting epoxy resin. The surface of the package is modified by UV-irradiation to have adhesive properties to polyamide. A plurality of connector terminals extend from the package and housing in parallel. A portion of the terminals is also sealed in the housing together with the package. Thus, the...