
This application discloses a method of joining two materials together by alloying wherein only a portion of one of the materials is heated to a temperature less than its melting point but greater than the eutectic temperature of the two materials. After the portion of the material has been so heated, the second material is brought into contact with the heated portion. A cooling medium may be passed over the materials alloyed to aid in the cooling of the alloy junction. A preferred embodiment of ...











