A surface-mountable packageless hybrid comprising a ceramic substrate with circuit elements attached to a top surface of the substrate is soldered to a ground pad on a printed circuit board. A high performance transition for microwave frequency signals between the circuit board and the substrate is provided by RF connections comprising three gull wing shaped leads connecting three solder pads on the printed circuit board to three solder pads on the substrate, the solder pads having capacitive ma...

The invention relates to a microcircuit card having a card support with a cavity in which a cover foil (200) is fixed, which foil (200) includes a circuit support (20) and at least one circuit (210) arranged on an inner surface of the circuit support (20) facing towards the interior of the cavity, the circuit (210) being arranged opposite a first portion of a bottom of the cavity. The circuit support (20) includes on its lower surface at least one energy transfer element (220) arranged opposite ...

A method is disclosed for producing a flexible microcircuit of a size usable in vivo in the arterial or venous tract of a human. The method comprises forming, by various photoresist techniques, conductive runs on a polyimide base of about 1-2 mils thickness. Each end of a flexible microcircuit has minute holes formed therein for connection to an electronic chip and to hard wiring. The method produces holes in the conductive runs for the electronic chip connection of about 0.002 inches in diamete...

An improved protective carrier for microcircuit devices having beam leads wherein a compressible member is disposed on the carrier base beneath and overlapping the periphery of an aperture in a flexible circuit element, the element being adapted to receive and make electrical contact with microcircuit device beam leads, the compressible member disposed or arranged to achieve flexing of the circuit element against the microcircuit device beam leads to conform to variations in thicknesses of the d...

A turbine engine component has an airfoil portion having a pressure side, a suction side, a leading edge, a trailing edge, and a tip. The component further has a first cooling microcircuit embedded in a pressure side wall, a second cooling microcircuit embedded in a suction side wall, and a system for cooling the tip comprising a first tip cooling microcircuit receiving cooling fluid from the first cooling microcircuit and a second tip cooling microcircuit receiving cooling fluid from the second...

Embodiments of methods in accordance with the present invention provide three-dimensional carbon nanotube (CNT) integrated circuits comprising layers of arrays of CNT's separated by dielectric layers with conductive traces formed within the dielectric layers to electrically interconnect individual CNT's. The methods to fabricate three-dimensional carbon nanotube FET integrated circuits include the selective deposition of carbon nanotubes onto catalysts selectively formed on a conductive layer at...

Embodiments of methods in accordance with the present invention provide three-dimensional carbon nanotube (CNT) integrated circuits comprising layers of arrays of CNT's separated by dielectric layers with conductive traces formed within the dielectric layers to electrically interconnect individual CNT's. The methods to fabricate three-dimensional carbon nanotube FET integrated circuits include the selective deposition of carbon nanotubes onto catalysts selectively formed on a conductive layer at...

A circuit, for incorporation into an electrical system, for providing a clock signal frequency to other circuitry such as a microprocessor and/or co-processor circuitry. The clock signal frequency varies its speed depending on the available voltage and current from a host power source. The circuit maximizes clock frequency by lowering the available voltage and increasing the available supply current. The circuit can therefore provide a higher clock speed and more current for switching transistor...

A cooling circuit disposed within a first wall portion and a second wall portion of a wall for use in a gas turbine engine is provided. The cooling circuit includes a plurality of inlet apertures disposed in the first wall portion to provide a flow path of cooling air into the cooling circuit, a first exit slot disposed in the second wall portion to provide a cooling air flow path out of the cooling circuit, a plurality of pedestals arranged in rows extending between the first wall portion and t...

A microcircuit testing device, comprising an element for supporting a plurality of probes which are meant to make contact with pads of microcircuits to be tested which are formed on a wafer, the probes being directed substantially vertically to the supporting element, and connection elements suitable to connect ends of the probes, which are arranged opposite to ends for contact with the pads, to an element for providing an electrical interface between the connection elements and electric connect...