A microcircuit package and sealing method in which a non-organic coating is used to hermetically seal the microcircuit. The microcircuit is isolated and insulated in order to protect the microcircuit from the high temperatures required to apply and cure a non-organic coating. The materials and methods used to isolate and insulate the microcircuit are chosen so that the thermal coefficients of the materials are complementary and thus form a highly reliable, durable seal, while also insulating the...

Individual ceramic substrates for electronic microcircuits are formed in an array having rectangular perforations which define score lines along which the array is broken to yield the individual substrates. The surfaces of the rectangular perforations are metallized and leads are attached thereto by thermocompression bonding after the array is broken. The rectangular perforations result in semi-rectangular openings around the periphery of the individual substrates, which eliminate tensile forces...

A decoupling apparatus for a microcircuit provides for a custom capacitor to be placed directly on the passivated upper surface of the integrated circuit or alternatively to be placed directly under the integrated circuit. In another alternative, multiple standard chip capacitors are placed directly on the passivated upper surface and connected by wire bonds to metal bars also resting on the upper surface.

A phase shifter for microwaves is monolithically formed from a silicon panel with a grounded metallic bottom layer and a metallic top layer defining a central conductor strip longitudinally subdivided into several line segments by junctions with reactive shunts spaced a quarter wavelength apart. Each shunt path includes the series combination of a condenser and a diode both integral with the monobloc panel. Successive diodes are provided, in pairs, with common biasing leads for alternately block...

A microwave integrated circuit is comprised of a ferrite plug in an alumina substrate, fused therein by a glass composition thermally compatible with both plug and substrate, thereby filling any voids at the interface with dielectic material to minimize circuit losses. The method of assembly permits metalizing the substrate after insertion of the plug, minimizing conductive tracking on the substrate, and facilitating alignment of the metalized circuit with the plug.

A probe for coupling electrical test equipment to a selected point of an electrical device has a resiliently supported rigid pin for contacting the selected point and a wave guide of substantially constant characteristic impedance coupling the test equipment to the pin.

A method for mounting a microcircuit module in a card body to make the card non-detachable without damage includes fixing the module (22) in a cavity (12) of the card body (11) with a resin after adjusting the adherence of the resin (30) on the wall of the cavity (12) so that it is markedly higher than its adherence on the module (22).

A turbine engine component such as a turbine blade includes an airfoil portion formed by a suction side wall and a pressure side wall, and a cooling microcircuit incorporated in at least one of the suction side wall and the pressure side wall. The cooling microcircuit comprises a channel through which a cooling fluid flows, at least one exit hole for distributing cooling fluid over a surface of the turbine blade, and internal features within the channel for accelerating the flow of cooling fluid...

A thin-film microcircuit on a metal substrate with an oxide film on which resistors, capacitors and their interconnections are formed, the metal substrate serving as an electrode for the capacitors, and simultaneously, as the ground as well as a heat sink.

A system is disclosed for exposing to ultraviolet light a semi-conductor or hybrid substrate coated with photo-resist, in back of a mask having bars and very narrow slits, the diffraction patterns ordinarily experienced at the substrate being virtually eliminated through use, between the light source and the mask, of a light integrator comprised of two successive matrixes of very small lenses or lenticules. The lenticules form a large number of magnified, superimposed, slightly displaced images ...