A turbine engine component has an airfoil portion with a suction side. The component includes a cooling microcircuit embedded within a wall structure forming the suction side. The cooling microcircuit has at least one cooling film hole positioned ahead of a gage point for creating a flow of cooling fluid over an exterior surface of the suction side which travels past the gage point. The cooling microcircuit is formed using refractory metal core technology. A method for forming the cooling microc...

A carrier for microcircuit packages in which the packages are releasably interlocked within the carrier by a snap-fitting arrangement.

A method of manufacturing an elementary slice provided with a microcircuit and having terminal connections in the form of metallic bumps which ensure the connection of the microcircuit to external circuitry. A major slice is provided in which a number of elementary slices are formed which adjoin each other along future severing lines. Lands are provided on which to grow metallic bumps. In order to be able to electrolytically grow the metallic bumps on the lands, the latter are series-connected t...

Contact electrodes and electronic device interconnection pathways are formed by sputtering and by deposition methods supplemented by plating. These may be formed, for example, on integrated circuit wafers or mounting substrates.

Embodiments of methods in accordance with the present invention provide three-dimensional carbon nanotube (CNT) integrated circuits comprising layers of arrays of CNT's separated by dielectric layers with conductive traces formed within the dielectric layers to electrically interconnect individual CNT's. The methods to fabricate three-dimensional carbon nanotube FET integrated circuits include the selective deposition of carbon nanotubes onto catalysts selectively formed on a conductive layer at...

A soldering pen for microcircuit production comprises an outer tube of substantially hollow cylindrical configuration having a predetermined diameter and length. An inner tube of substantially hollow cylindrical configuration is coaxially positioned in the outer tube in spaced relation therewith and has a diameter smaller than that of the outer tube and a length shorter than that of the outer tube. Both tubes are open at one end. A substantially conical cover is provided over both tubes at the o...

Integrated circuit devices are mounted on a thin polyimide laminate substrate which is bonded around a heat sink and support member to form a module. Conductive circuit paths carried on both external and internal planes of the laminate substrate link the integrated device circuits to spaced contact areas along edge areas of the substrate. A pressure cap surrounds the module and is flexed with a tool to permit low insertion force engagement of the module with a board structure including a polyimi...

An encapsulated microcircuit device including a wafer of semiconductor material, an intermediate coating of silicon dioxide on the wafer, a metal interconnect pattern on the silicon dioxide coating and having portions extending therethrough to the wafer, an outer coating on the intermediate coating and on the metal interconnect pattern and being composed of glass and a metal oxide and having a coefficient of thermal expansion substantially equal to that of the interconnect pattern and the silico...

A manually operated X-Y coordinate cutter for making surface cuts with great accuracy in all three cutting dimensions. The cutting blade is rotated to cut in the X or Y direction and adjusted, in combination with a roller which contacts the work, to make cuts of uniform depth in the work. The roller and cutting blade are spring-mounted to ride smoothly over surface irregularities while maintaining a constant cutting depth. A pattern, placed between a translucent cutting surface and a translucent...

Improved chromium film glass based articles having a low incidence of film surface defects, and highly hardened extremely scratch and wear resistant quality. The method includes the use of a substantially alkali-free glass substrate upon which is formed a chromium film, after which the composite so formed is heat treated to obtain the desired film hardness and electromagnetic energy reflective quality.