Deposited on a glass or ceramic substrate for a thin-film microcircuit board such as a hybrid IC board or a transparent electrode is a thin-film laminate, which comprises a dispersion metal thin-film dispersible and evaporable upon application of an energy above a threshold value and an electrical property-imparting film defining a conductor or a resistor. Then a high intensity of light having an energy sufficient to cause dispersion is applied selectively on the thin-film laminate, thereby remo...

A machine to generate the art work in making photomasks for microcircuits. A photoplate is mounted on a precision X and Y coordinate table underneath a microflash camera having a master reticle holder holding a master reticle plate. The master plate has a plurality of apertures of different sizes, shapes and configurations. Lines and designs are traced on the receiving plate by scanning it and flashing the camera lamp through the aperture. The positions of the X and Y table is measured by interf...

A very-fine microcircuit interconnecting wire is passed through a central ifice in a capillary bonding head of a thermo-compression device which is used for pressing the balled end, or the body, of the microcircuit interconnecting wire to the metallized pads of a hybrid circuit chip. A pair of capillary tubes are moveably attached to the capillary bonding head in such a way that they can be positioned with their orifices opposing each other on opposite sides of the very fine wire just below the ...

A process is disclosed for exposing to ultraviolet light a semi-conductor or hybrid substrate coated with photo-resist, in back of a mask having bars and very narrow slits, the diffraction patterns ordinarily experienced at the substrate being virtually eliminated through use, between the light source and the mask, of a light integrator comprised of two successive matrixes of very small lenses or lenticules. The lenticules form a large number of magnified, superimposed, slightly displaced images...

A stackable microcircuit layer formed from a plastic encapsulated microcircuit (PEM) and method of making the same is disclosed. The method involves the steps of starting with a commercially available PEM (e.g. a plastic Thin Small Outline Package or TSOP) that contains a microcircuit or die within an encapsulant and modifying the PEM to expose conductive members that are electrically connected to the microcircuit's bond pads. In the case of a TSOP, the preferred modifying step is accomplished b...

High density heatsinks for microcircuit packages are formed by first mold-pressing a composite powder of free-flowing spray-dried particles of an inexpensive high thermal conductivity material having a high coefficient of thermal expansion (CTE) such as copper and at least one other low CTE material such as tungsten, the proportions of which are adjusted to match the CTE of the microcircuit material. The pressed compacts are sintered in order to achieve an homogeneous distribution of the melting...

A system for testing semiconductor microchips is provided in which indivil microchips can be tested electrically and under specific thermal conditions simultaneously to determine the reliability of the microchip under operating conditions. This system is unique and economically operable so as to enable all individual chips to be tested prior to mounting in larger assemblies.

A disk (110) carries containers (such as 120) each containing a stack of cards capable of being extracted one-by-one via an orifice (126) when a wheel (151) is moved to an extraction position (151A). A first conveyor (140A) then conveys the extracted card to a programming unit (1) which is capable of being moved to a position enabling a card to be inserted therein without friction, and thereafter lowers a connector (6) onto the card. After the card has been validated and inspected, it is conveye...

A multi-component microcircuit package is formed from a plurality of separate components which are secured together to form a lower package portion using a base and a continuous composite side wall frame having irregularities on its upper surface as a result of the component junctions. Secured to the top of this side wall frame is a one-piece continuous top frame member having a uniform upper surface. This top frame member covers the irregularities present in side wall frame and provides a surfa...

A fixture for use in testing microcircuit assemblies, such as flat panel displays and silicon wafers, has a high dielectric strength or resistivity fixture body with density less than 1.9 gm/cm.sup.3. The fixture therefore has low inertial properties and may be used with mechanical positioning components in microcircuit test apparatus in enlarged fixture sizes without diminishing test apparatus response or accuracy characteristics. The fixture body has conductive and insulating layers applied th...