A method for forming a conductive vias in a non-conductive substrate having a through-hole formed therein intermediate two side thereof. The method utilizes the steps of: applying gold paste to the through-hole so as to provide electrical conduction therethrough; and under firing the gold paste when a thin conductive film is present upon the substrate and fully firing the gold paste when no thin conductive film is present on the substrate. Under firing the gold paste when a thin-film is present ...

The invention relates to a device for protecting a memory or microcircuit unit, such as a PCMCIA card. The device comprises a mounting place receiving the memory or microcircuit unit and a protective lid. The lid pivotably attached to a locking mechanism of the protective device, operated by a removable key, is turned to protect the memory or microcircuit unit positioned in its place, when the key is turned to an ON position in the protective device.

The microcircuit card is such that at least one strain-indicating sensor is placed on the microcircuit, in a known state of strain, and is maintained in this state by a protection layer deposited on the microcircuit for as long as this layer is not affected. The microcircuit has means for measuring an electrical value that is characteristic of the strain, and a logic circuit connected to the measuring means to detect the changes in the condition of strain indicating an intrusion into the card.

A space transformer for electrically interconnecting a probe head to a printed circuit board, which includes a flexible multilayer circuit with device under test contact pads formed on a first side and printed circuit board contact pads formed on a second side. Electrically conductive circuit traces extend between the device under test contact pads and the printed circuit board contact pads. A shim plate is fastened to a periphery of the first side of the flexible multilayer circuit and a bottom...

A device includes a transparent conductor formed on a substrate. Electromagnetic radiation (EMR) (such as may be received from an on-chip, ultra-small resonant structure or from an off-chip light source) is directed into the transparent conductive layer. One or more circuits are formed on the transparent conductive layer and are operatively connected thereto to receive at least a portion of the EMR traveling in the transparent conductor. The EMR may be light and may encode a data signal such as ...

An improved cooling design and method for cooling airfoils within a gas turbine engine is provided which includes an embedded microcircuit that traverses a tip between a suction sidewall and a pressure sidewall of the airfoil. The microcircuit includes at least on inlet disposed proximate to the tip and one of the sidewalls for receiving cooling air from an internal cooling cavity of the airfoil and at least outlet disposed proximate to the tip through which the cooling air ejects into a region ...

A microcircuit package with an integrated acoustic isolator made up of a stacked acoustic filter. The package includes a rigid, electrically conductive housing with a IC module mounted therein. The acoustic filter includes two electroacoustic transducers mounted on opposite sides of a common wall of the package, one inside the package and the other outside. An a.c. power source is connected to the transducer that is mounted on the outside of the package. Electrical energy from the power source i...

A microcircuit flat package which remains hermetically sealed even under conditions of high stress. The package comprises an integral rectangular metal tubular shell having an opening in one of the broad walls, and elongated integral insulators sealed in the open ends of the tube, each insulator having an array of leads extending in sealed manner therethrough. A microcircuit is installed within the package and connected via wire bonds to the inner ends of the leads and after which a cover can be...

A ceramic substrate includes a multiplicity of alternately screened and fired conductor and dielectric levels, with interconnections between levels through small via holes in the dielectric layers or alternately by means of crossovers. Thick film resistors are incorporated throughout the ceramic substrate, wherever needed, and the thick film resistors are printed and trimmed through windows which extend through any upper layers. In addition, resistors may be printed directly on top of the dielec...

A ceramic substrate includes a multiplicity of alternately screened and fired conductor and dielectric levels, with interconnections between levels through small via holes in the dielectric layers or alternately by means of crossovers. Thick film resistors are incorporated throughout the ceramic substrate, wherever needed, and the thick film resistors are printed and trimmed through windows which extend through any upper layers. In addition, resistors may be printed directly on top of the dielec...