A method and apparatus for protecting hypersensitive microcircuits on the face of a semiconductor wafer from contamination and mechanical damage during die sawing and subsequent die handling operations include the provision of a plastic sheet having an array of protective domes formed into it, the array corresponding to the array of microcircuits on the wafer, and the temporary adhesion of the sheet to the face of the wafer such that each die in the wafer is covered by a respective one of the do...

The present invention is a package for housing microcircuit components and the method of manufacturing the same, the latter of which includes the steps of explosively bonding first and second dissimilar metals to produce a base member, machining that base member to produce a flat bottom portion with upstanding side walls defining an interior volume in the first metal, the side walls of which are surmounted by a ring formed of the second metal, whereby the said ring can be low temperature welded ...

A wafer scale integration arrangement wherein integrated circuit die of varying size, fabrication processes, and function are commonly mounted in the same host wafer using a filled epoxy material of special characteristics. The mounting epoxy material also serves as a substrate for the die interconnecting conductors in regions adjacent the mounted die. The described assembly also includes a newly available photosensitive polyimide material as a planarization and passivation covering for the die ...

A method for manufacturing a turbine engine component comprises the steps of forming a first half of an airfoil portion of the turbine engine component and forming a plurality of microcircuits having at least one passageway on an exposed internal wall of the first half of the airfoil portion. The method further comprises forming a second half of the airfoil portion of said turbine engine component, and forming at least one additional cooling microcircuit having at least one passageway on an expo...

To minimize the deposition of materials in portions of a microcircuit structure beyond those intended to be deposited upon through openings in a mask, a special mask holding arrangement is used. This arrangement can be used with several deposition methods which include sputtering and evaporation as well as supplementing these with plating techniques.

A device includes a waveguide layer formed on a substrate. An ultra-small resonant structure emits electromagnetic radiation (EMR) in the waveguide layer. One or more circuits are formed on the waveguide layer and each operatively connected thereto to receive the EMR emitted by the ultra-small resonant structure. The waveguide layer may be transparent at wavelengths corresponding to wavelengths of the EMR emitted by the ultra-small resonant structure. The EMR may be visible light and may encode ...

A wafer scale integration arrangement wherein integrated circuit die of varying size, fabrication processes, and function are commonly mounted in the same host wafer using a filled epoxy material of special characteristics. The mounting epoxy material also serves as a substrate for the die interconnecting conductors in regions adjacent the mounted die. The described assembly also includes a newly available photosensitive polyimide material as a planarization and passivation covering for the die ...

An electrically conductive probe of controlled shape and dimension useful in testing the functionality and performance of microcircuits and a method for manufacturing it are disclosed. The probe may be generally square or rectangular in cross section and consists of three distinct sections; the terminal end which is capable of being electrically contacted, the shaft which connects the terminal end to the probe tip, and the probe tip which is to make electrical contact with a microcircuit.

A microcircuit package formed of a dielectric substrate having a central area for mounting a circuit network device therein, such as a chip or wafer, metallic leads embedded in the substrate, grooves formed in one surface of the substrate providing between them raised portions or lands interconnecting the free ends of the leads with the recess and a conductive material on the lands thereby forming a raised conductive path from the leads to the recess. The invention also includes a method of maki...

A connector assembly suitable for connecting a leadless integrated circuit device to a circuit board. The circuit device typically has a plurality of flat conductive pads spaced along parallel edges thereof. The circuit board similarly typically has a plurality of flat conductive pads spaced along parallel first and second rows. The connector assembly includes a pair of anchor plates bonded to the circuit board and spaced by a distance just sufficient to accommodate said integrated circuit devic...