A laser beam deflector is useable for protecting underlying portions of an item during laser cutting of overlaying stock. The deflector has a base surface width greater than the overlying stock to be cut and a smooth deflecting surface of an arcuate cross-sectional configuration. The deflector is positionable between the overlaying stock and the underlying portions desired to be protected with the deflecting surface immediately adjacent the overlaying stock.

An AC-DC converter that includes a plurality of power conversion units that overlay their signals to generate a DC signal with low voltage level, small voltage and current ripples, but high DC current. The DC signal is further filtered by a LC low pass filter to further minimize the ripples before output to the load. In one embodiment, the plurality of power conversion units is preferably powered by a plurality of input pulse generators. In an alternative embodiment, the power conversion units i...

An inert-gas-shielded submerged arc welding process which prevents emission of noxious gases when overlaying aluminum bronze on a steel base. Apparatus is also disclosed for confining granular flux in the proximity of a welding torch when making an overlay on a cylindrical surface.

A transistor is formed which has improved hot carrier immunity. On a substrate, between two source/drain regions, a gate region is formed over a dielectric region. An implant is used to dope the source/drain regions. After doping the source/drain regions, a tilted angle nitrogen implant is performed to implant nitrogen into areas of the dielectric region overlaying the drain/source regions of the transistor. The tilted angle nitrogen implant may be performed before or after forming spacer region...

A method of overlaying onto a parallel processing network configured as an initial hierarchical tree one or more other virtual trees for concurrently performing parallel processing operations via each tree. Tree connect messages identifying a second tree are transmitted from leaf nodes of the initial tree that are to become members of the second tree to a root node of the initial tree. Status information is updated at each node in response to the transmittal and receipt of a connect message. Ack...

A photo-electric imaging device having an array of rows (7) of minute electrodes (8) and an array of columns (1) of electrodes (4) overlying the rows and separated by semiconductor layer (6). Imaging plates (11) are positioned above each pair of respective electrodes (4, 8) and separated from them by an interface (10). A photoconductive layer (12) may be placed over the imaging plate (11). A writing surface (12) over the imaging plates (11) is produced which comprises a multiplicity of spaced di...

In order to overlay a stainless steel material for decorative articles and ornaments with a precious metal alloy, a comparatively thin layer of said alloy or a plurality of constituent thin layers of said alloy are overlaid on a selected surface of said stainless steel and heated to a temperature higher than 800.degree. C. for the diffusion bonding of said layer or layers to the stainless body and for annealing of said body, and thereafter another thicker layer or constituent layers of a preciou...

The present invention provides method and apparatus for joining together two or more overlaying sheet formed metals, either metallic or non-metallic, in which a movable punch is moved towards a stationary die axially in a first direction and into a first position that is independent of the thickness or the number of sheet formed members to be joined together. Thereafter, an anvil is co-axially moved towards the die and into a second relative position that is also independent of the thickness or ...

A pre-formed integrated circuit chip is encapsulated into an electronic package, by forming an interconnect assembly separately from the pre-formed integrated circuit chip. If the interconnect assembly tests good it is bonded to the prepared integrated circuit chip. The interconnect assembly is flip bonded to the chip. The interconnect assembly and chip are passivated or potted into an integral structure to provide the electronic package. At least one test pad is defined in an interconnect layer...

High resolution, high packing density printed circuit wiring with high conductivity wiring is achieved by putting down thick (0.006 in., 0.015 cm) liquid photopolymer insulator layers on an inexpensive substrate and photodeveloping conductor pattern indentations in the layer for filling with conductive materials. Thus, 0.003 in. (0.008 cm) line to line spacings can be achieved with high conductivity conductors 0.006 in. (0.015 cm) thick. A flush top layer of polymer is readily cleaned of contami...