A planar, rigid substrate made from a porous, inorganic material coated with cationic polymer molecules for attachment of an array of biomolecules, such as DNA, RNA, oligonucleotides, peptides, and proteins. The substrate has a top surface with about at least 200 to about 200,000 times greater surface area than that of a comparable, non-porous substrate. The cationic polymer molecules are anchored on the top surface and in the pores of the porous material. In high-density applications, an array ...

Improved macroporous ink receptor media are disclosed. An inkjet receptive media in accordance with one embodiment of the present invention comprises a web comprising a plurality of fibers and a coating overlaying at least a portion of a plurality of the fibers. In a preferred embodiment, the coating comprises a plurality of organic particles. In a preferred embodiment, the fibers define a plurality of pores. In a preferred embodiment, the web defines a plurality of macropores. The fibers of the...

A method for the manufacture of a solid porous separation material based on a polysaccharide, said method comprising the steps of: (a) providing an aqueous solution (I) of a polysaccharide, (b) solidifying the solution, preferably by transforming the solution to a gel, and (c) optionally crosslinking the polysaccharide, with the proviso that, if step (c) is present, steps (b) and (c) may be carried out simultaneously. The method is characterized in that the polysaccharide provided in step (a) is...

Implant intended to be fixed through contact with new grown bone tissue comprising a dense material having an implant surface, and having, at least within a surface portion of the implant surface, surface pores covering at least 5% of the surface portion. The surface pores constitute a contact surface for new grown bone tissue, wherein close to at least a substantial fraction of all of the surface pores has at least one elevation extending over the implant surface which completely or at least pa...

A heat sink is disclosed having an elongate, porous metal structure, including multiple sets of thermally conductive members. The members, which are interwoven, direct heat away from a heat producing component. The elongate structure of the matrix structure can be formed in a variety of predetermined forms, including a coiled structure or an elliptically coiled structure. Alternatively, the matrix structure is plated for added thermal conductivity between the sets of members. In addition, air fl...

Disclosed are systems and methods that include a flow-cell that includes porous conductive material(s) that provides a working electrode(s), an inlet connected to the flow-cell to deliver a solution continuing an analyte(s), an outlet connected to the flow-cell to allow the solution to exit the flow-cell, a counter electrode positioned proximate to the outlet, and a voltage source(s) coupled to the working electrode(s) and the counter electrode. The methods can include delivering a solution cont...

Methods of preparing porous optical materials are provided. These methods allow for the selection of the desired pore size and level of porosity in the porous optical material. Such methods utilize a preformed polymeric porogen.

Approaches are described for producing porous, polymer electrodes with good characteristics for incorporation into polymer batteries. Two preferred processes are presented. The polymer electrodes can be subjected to additional processing to increase their porosity and electrical conductivity. The polymer electrodes preferably are incorporated into a polymer battery where the components are laminated together.

The present invention relates to microporous starch granules surface coated with a hydrophobic agent said granules useful in absorbing hydrophobic malodorous materials either from the liquid or gas phase. The hydrophobic granules are useful in controlling the malodors associated with catmenials and hygienic undergarments as well as being useful for absorbing unwanted food and other environmental malodors.

This is a method of forming mechanically robust vias and entrenched conductors on a dielectric layer (which dielectric layer is on an electronic microcircuit substrate which vias and entrenched conductors are electrically connected to a conductive area on the surface of the substrate) and a structure formed thereby. Generally some of the dielectric layers added above the microcircuit comprise a porous dielectric having a desirable low dielectric constant but low mechanical robustness. Special me...