Disclosed herein is a thermal display system including a plurality of very small air-isolated semiconductor mesas or bodies, each of which contains a heater element so that when the heater element is energized a "hot spot" is formed at the top surface of the mesa to provide a localized dot of heat. By interposing a thin, flexible wear-resistant material, such as, for example, a thin paper or high-temperature plastic, between the mesas and a display medium, such as, thermal-sensitive paper, wear ...

In a printhead for electrostatic printers, the styli of the printhead are formed on a monolithic substrate, such as a printed circuit board. Each stylus has its own driver circuit incorporated into one or more integrated circuit die which are mounted directly on the monolithic substrate, and electrically connected to traces formed on the printed circuit board. The styli are the ends of the traces as formed on the edge of the substrate. The integrated circuit die are connected to the traces by wi...

A writing head for an ink printing device characterized by piezo-electric drive elements being formed by piezo-electrical laminae having cut edges shaped to produce a discharge opening in communication with an ink chamber which is separated from an ink supply channel by a choke channel. The laminae are arranged with spacer elements in a stacked arrangement to form the writing head with a plurality of discharge openings which can individually discharge droplets of ink.

A thermal printhead comprises a support plate, a head substrate mounted on the support plate, a connector board reinforced by a backing member which rests on the support plate, and a presser member overlapped on the connector board. The connector board has a marginal portion projecting beyond the backing member. The presser member is pressed by screws for pressing the marginal portion of the connector board into contact with the head substrate. The backing member is made of a material having a g...

In a print cartridge according to the preferred embodiment of the invention, a polymer tape having orifices formed therein and containing conductive traces has a substrate containing heater elements affixed to a back surface of the tape. Each of the heater elements in the substrate is located substantially behind each of the orifices. The edges of the nozzle member overlap the edges of the substrate, and the back surface of the tape is sealed with respect to an ink reservoir so that a seal subst...

A printhead for a dot matrix impact printer comprises a stack of thin printing blades each including a flat spiral coil mounted in a rim which is in turn connected by flexible mounting arms to a mounting portion. Each blade has an arcuate printing arm extending from one side of the rim thereof and carrying a stylus, with the printing arms of adjacent blades being curved in opposite directions with the concave sides thereof facing each other so as to provide therebetween a large separation area t...

A thermal printhead has heating elements arranged for multiplexing so as to limit the number of leads required to selectively energize the heating elements. Current diverting resistors are utilized to act as a shunt path to divert current from certain of the heating elements to prevent unwanted shadows from being produced on the thermal sensitive paper.

A printhead assembly for a typewriter of the kind that swipes a printhead along a ribbon in producing marks on a receiving medium, is mounted to pivot and includes a ribbon guide that serves to wrap the ribbon around the trailing side (for a forward printing direction) of the printhead. The assembly is positioned to permit the printhead to be rotated to a normal printing position at a printing line. By so arranging the ribbon path that the ribbon directions for arrival and departure of the assem...

An improved wire matrix ballistic impact printhead apparatus including a plurality of engaging structures for maintaining the armatures of a like plurality of electromagnetic actuators in proper positional alignment with the associated print style, for allowing individual adjustment of armatures to optimize printhead operation, for preloading the armatures with a force that will return them to their original position after the printing operation, and for damping vibrations at printhead operating...

In a method of mounting electronic devices, a gold lead is connected to each contact pad of each wafer in a semiconductor slice. In a parallel step, a body of wafer receiving material is secured to a support and is thereafter separated into wafer receiving members. Then, a layer of epoxy resin is applied to the slice, and the slice is secured to the wafer receiving members with each wafer mounted on a wafer receiving member and with the gold leads positioned between the wafers and the wafer rece...