An inkjet printing device is arranged to employ a first set of multiple nozzle drop generators activated by a first address signal and a second set of multiple nozzle drop generators activated by a second address signal. The multiple nozzles of each drop generator of the first set are arranged in a predetermined geometric pattern, each of which encompasses at least one nozzle of a drop generator of the second set. The ink ejectors of one drop generator of the first drop generator set are arrange...

An ink jet print head apparatus having a reduced thickness passivation layer. Passivation layer thickness is preferably below 7000 angstroms to permit operation at a lower turn-on-energy. The passivation layer is preferably formed in a discrete manner and may include a nitride layer and a SiC layer. Various other layer arrangements are also described including the provision of a cavitation layer over the passivation layer. A thermal or other type of ink expulsion mechanism may be utilized.

Pillars are formed in a fully integrated thermal inkjet printhead to prevent particles from entering into a nozzle chamber along an ink refill channel. The pillars are formed after a step of applying a thin film structure to a substrate. At one step, pits are etched through the thin film structure. At another step, material for an orifice layer is deposited into the pits. At another step, a firing chamber is etched into the orifice layer. At another step, a trench is etched into the backside of ...

A thermal printhead according to the present invention includes a substrate, a plurality of heating elements formed on the substrate, at least one drive IC for driving the heating elements, and a sealing portion for sealing the drive IC. The sealing portion contains a resin material and a granular filler having an average grain size not greater than 10 .mu.m.

The object of the invention is to enhance precision in bonding the heating board and the radiating plate of a thermal print head, in the thermal print head A composed by attaching the heating board 2 on the surface of which a heating resistor for printing 4 is formed on the upper surface of the radiating plate 1, an identification mark M that functions as a positioning reference when the heating board 2 is attached on the radiating plate 1 is provided on the heating board 2 at a fixed interval f...

A printhead comprises a source of ink, a body, a mounting base, and an ink heater thermally coupled to the mounting base. A flowpath delivers ink from the ink source to the heater and is defined at least in part by the mounting base on the body. Three or more thermally conductive paths extend from the mounting base to the body. Preferably, one or more of the thermally conductive paths are heat conductive bridges extending from the mounting base to the body through an edge feed via.

A printhead for printing on a print media includes a column of nozzles oriented at an angle to an axis of relative movement between the printhead and the print media, and a print axis oriented substantially parallel to the axis of relative movement between the printhead and the print media such that at least some of the nozzles are variably aligned to the print axis.

A trolley of a printer includes a pair of angularly upright projecting dovetail-like fingers spaced apart near a left edge thereof, and a spring biased wedge pin located near a right edge thereof, for slideably engaging chamfer-like surfaces on the left and right-hand sides of a printhead assembly, respectively, for permitting the assembly to be snapped into and out of retention upon the trolley, the trolley further including right and left hand leaf springs located near its rear edge for pushin...

A current shunt multiplexed driver circuit in a high resolution multi-wire printhead is provided for use in an electroerosion printer. The circuit can reduce to the number of active devices required per print wire to two times the square root of the number of wires.

A protective passivation structure is provided for a thermal ink jet printing head which employs a resistive heating element formed of phosphorus-diffused silicon. The passivation structure includes a layer of silicon nitride over the heating element with a layer of silicon carbide over the silicon nitride layer. The nitride exhibits good adhesion to the underlying silicon as well as good thermal conductivity. The carbide has exceptionally good wear and hardness qualities against ink bubble cavi...