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A thick film paste for use in the formation of a conductor, a resistor, an insulator, a protector or the like in a ceramic wiring substrate by a printing process, wherein at least 2-tetradecanol as a solvent is contained in an amount of at least 3% by weight. The thick film paste is excellent in printability, for example, has less viscosity change during printing and exhibits less bleeding.
A combustor liner includes panels joined together at a cooling nugget including a bridge and a lip extending therefrom. The lip defines a slot terminating in an outlet. Thermal barrier coating covers inboard surfaces of the panels and lip with a nominal thickness. The lip has a distal end at the slot outlet which is spaced from the coating aft of the slot less than about the coating nominal thickness.
A thick-film electric heater having thick-film layers applied directly on a thermally conductive non-flat substrate. Preferably, the substrate is cylindrically shaped. A dielectric layer is silk-screened on the substrate surface. A resistive layer is silk-screened on the dielectric layer to form a circuit for the generation of heat. The resistive layer has at least one resistive trace in a pattern that is discontinuous circumferentially. At least a pair of silk-screened contact pads are applied ...
A thick film circuit on an insulating substrate includes a thermal fuse. The circuit includes a conductive strip, which may be sufficiently resistive to comprise the resistor of an automotive fan motor controller, which is made of a material dissolved by a solder which melts at a predetermined temperature. When an abnormal event occurs which raises the temperature of the circuit, the solder melts and dissolves the underlying conductive strip. The solder and melted material of the strip then coal...
Planarization of the top surfaces of layers that are more than about a micron thick is beset with problems not encountered in thinner layers. These problems have been overcome by means of a process that, initially allows the formation of `horns` in the surface that is to be planarized. Said horns are then selectively etched away while other parts of the surface are protected, following which CMP is initiated and the surface gets planarized. A total of four embodiments are disclosed.
A thick film thermal head includes a substrate which is provided with a linear groove and is heat-conductive at least at a part of the surface facing the groove. An elongated resistance heater is embedded in the groove to be in contact with the part of the surface of the substrate at which the substrate is heat-conductive, and a plurality of electrodes are formed on the surface of the substrate in contact with the resistance heater and arranged in the longitudinal direction of the resistance hea...
A looper for thick metal strip has a large-diameter outer basket centered on an upright axis and a small-diameter inner basket axially above the outer basket and centered on an upright axis. The strip is fed on edge and generally tangentially into the outer basket to form therein a large-diameter spiral having an inner end. Then the strip is fed upward from the spiral inner end around the inner basket and is finally pulled tangentially from the inner basket. The strip is straightened generally a...
A housing having a central bore therein receives a rotor rotatably mounted therein and secured thereto having an enlarged round base portion. A thrust plate is mounted for limited axial reciprocation within a recessed opening in the housing concentric with the rotor and adjacent the rotor base. The rotor base and thrust plate are formed with cooperating detents and notches to provide indexing means for rotationally positioning the rotor. The internal recess of the housing and the exterior of the...
An alumina substrate thick film circuit includes capacitors sealed with two intermediate layers of non-conductive material and two layers of sealing glass. The temperature coefficient of expansion of the sealing glass is less than that of the substrate. The temperature coefficient of expansion of the intermediate layer material is intermediate those of the substrate and the sealing glass, or equal to that of the sealing glass.
A thick film capacitor is mounted on a substrate. The dielectric of the capacitor is barium titante which is combined with an alkali free barium zinc glass bonding agent having an electropositive element common with dielectric.
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