A pulley with an integral hub spun-roll formed of a disc of sheet metal where the hub has a thickness greater than the thickness of the sheet metal. The hub has a bore and external surface for attaching to other components.

A coating composition for thick coating prepared by adding an aggregate to a coating liquid containing 5 to 40% by weight as SiO.sub.2 of a coloidal silica and 3 to 40% by weight of dissolved and/or finely dispersed organic polymer, having an SiO.sub. 2 /M.sub.2 O mole ratio (in which M is a monovalent alkali metal atom) of at least 7, and having a viscosity lower than 100 c.p. at 20.degree. C when kept in the sealed state at 50.degree. C for 10 days. Said coating composition being especially su...

An abrasion resistant low temperature air fired thick film ink composition is disclosed. The composition includes a glass matrix material having a softening point below about 700.degree. C., a particulate conductive material and a particulate reinforcing material.

A thick film drawing apparatus includes a substrate holding member (50) for holding a substrate (a), moving coils (60) for holding the substrate holding member (50), a drawing head (20) having a nozzle (30) and a stylus (33) for emitting pastes for drawing on a surface of the substrate (a) moving thereon and pushing the substrate (a) downward, respectively, wherein in the drawing process the drawing head (20) is locked of up/down motions and the substrate holding member (50) is raised/lowered at...

A container comprising an inner container, inner lid, outer container and outer lid which is suitable for commercial transport and legible display of required label information, and can be readily grasped and handled such that the lid and contents can be safely and completely removed. The invention further relates to a plurality of such containers, each container having a different maximum capacity but a label area of at least the same size as the label area of the smallest container and the sam...

A thick film forming process according to the present invention comprises using the screen printing to form thick films in the vicinity of the edges or parts of large areas of a substrate, and next using the direct writing to form thick films of patterns on the other parts of the substrate. The process of this invention enables a circuit pattern in thick films to be changed easily in set conditions.

A method of forming thick film resistor circuits whereby a non-hole metal, such as copper, requiring a reducing atmosphere is included with resistor material requiring an oxidizing atmosphere. A fritless conductor paste with a small percentage of silver is deposited and fired in air at a low temperature. Resistors are then deposited and fired in air. Subsequently, the conductor material is reduced at a sufficiently low temperature so as not to adversely affect the resistors.

An improved ink composition suitable for the formation of thick film resistor inks which can be terminated directly to copper foil conductors. The subject compositions comprise an epoxy resin, conductive carbon particles, a suitable solvent and particulate alumina, wherein the alumina is present in an amount at least equal to the resin content on a weight basis.

A semiconductor photoconductor having low impedance nonmetallic contacts is disclosed which has increased detectivity over prior art photoconductor structures. The improved photoconductor has metallic contacts that are separated by a contact length that is greater than the optical length of the detector. The contact regions of the semiconductor adjacent the detector region are thicker than the detector region. The process for fabricating the photoconductor includes thinning the detector region t...

A novel construction for a thick film resistor is disclosed. A substrate has a first face deposited with a layer of resistive material. Between the substrate and this first layer is located a strip of conductive material. The strip of material is oriented at approximately right angles to the current path through the first layer, midway along the current path. A second layer of resistive material is located on a second face, parallel to the first face, and the first and second layers are connecte...