
An apparatus and method for depositing a thin layer of material such as metal within the hole of an object such as a printed circuit board. The apparatus includes a gas diffusion chamber having a plurality of power electrodes with apertures positioned transversely therein. The objects to be treated, such as printed circuit boards, are positioned in the areas between the power electrodes. A supply of electrical energy is connected to the power electrodes and to the conductive layers of the printe...











