Oxygen-transferable perfluorocarbon compounds having 9 to 11 carbon atoms such as perfluorodecalin, perfluoro(C.sub.3.sub.-5 -alkylcyclohexanes), perfluoro(C.sub.4.sub.-6 -alkyl tetrahydropyrans), perfluoro(C.sub.5.sub.-7 -alkyltetrahydrofurans), perfluoro(C.sub.5.sub.-7 -alkylmorpholins) and perfluoro(C.sub.9.sub.-11 -trialkylamines) are emulsified in a physiologically acceptable aqueous solution such as Ringer's solution by the aid of a phospholipid as emulsifier and a fatty acid of 8 to 22 ca...

A mold section is made by covering at least the surface of a cavity of a metallic substrate with a layer of plastic barrier material. A pattern is then placed on this so-covered surface. A compressive force and heat are applied to the metallic substrate and pattern causing the material of the layer to flow and then become bonded to the surface of the cavity while duplicating the surface and shape of the pattern.

A sheet of organic material having a creped or ridged formation is first coated with a film of silicone resin and then overcoated with a layer of a flexible organic resin. Both coatings conform to the ridged surface. The sheet is positioned inside a mold cover. When a plastic mixture is foamed, the top surface of the molded object contacts the flexible organic material on the surface of the sheet and adheres thereto. When the cover is removed, and the sheet peeled off, the molded article has its...

A method for forming an integrated circuit on an insulating substrate is described comprising the steps of forming a semiconductor layer on a seed wafer substrate containing an at least partially crystalline porous release layer, processing the semiconductor layer to form a "transferable" device layer containing at least one semiconductor device, and bonding said transferable device layer to a final, insulating substrate before or after separating said device layer from the seed wafer substrate....

A thermal transfer medium for use in mass transfer printing comprises a substrate bearing on at least part of one surface thereof a coating of an overlay material comprising polyester having a glass transition greater than 50.degree. C. (preferably at least 75.degree. C.) and a molecular weight in the range 6,000 to 10,000. The overlay material combines good transfer characteristics, barrier properties and durability and is highly transparent.

The invention provides a system and method for creating and facilitating the exchange of wagering-based transferable financial instruments. The instruments may be used to embody multiple various positions based upon the ultimate outcomes of uncertain future contingent events, including but not limited to outcomes of games of skill and chance. The invention further provides systems and platforms for monitoring, displaying information, and facilitating trading as to such instruments among multiple...

A metering system is provided including a smartcard reader and peripheral computer in communication with a metering apparatus. A smartcard with memory, microprocessor, and license counter may then be engaged with a smartcard reader in the metering system to effect meter license transactions. The license transactions may be purchased by a user either to enable enhanced functional meter features via a meter upgrade process or to disable functional meter features via a meter downgrade process. Such...

A transferable enamel sheet and the process for producing it is disclosed, which consists of a carrier film, a release layer applied thereon, a paint or enamel layer and an adhesive layer whereby a neutralization layer of wax-type consistency, preferably carnauba wax is applied to the release layer which is of the dimethyl-siloxane type (silicone). It is possible to preform two types of transferable enamel sheets. One of them is characterized by the adhesive layer between the neutralization laye...

A method for forming an integrated circuit on an insulating substrate is described comprising the steps of forming a semiconductor layer on a seed wafer substrate containing an at least partially crystalline porous release layer, processing the semiconductor layer to form a "transferable" device layer containing at least one semiconductor device, and bonding said transferable device layer to a final, insulating substrate before or after separating said device layer from the seed wafer substrate....

A game puzzle comprises a holder and a plurality of manipulatable elements movable within the holder along a plurality of closed-loop paths, which paths intersect each other at a plurality of intersection points. The manipulatable elements fill the closed-loop paths and are constrained by the holder to move only along one path except at the intersection points, whereat the elements may be transferred from one path to the other. In one described embodiment, the manipulatable elements are buttons ...