A slide switch actuating apparatus for operating a slide switch located inside a housing from the exterior thereof. A flexible retaining member engages the slide switch to be actuated on the interior of the housing. The housing is formed with a slot through which flexible hook members are received into a socket portion of a button member located exterior to the housing in a snap-fit fashion. A plurality of bosses with inclined surfaces are positioned on the interior of the housing adjacent to th…

A brazing operation, using a silver-copper alloy preform in a temperature range of from 800.degree. C. to 1100.degree. C., is employed to attach either radial or axial conductive leads to ceramic non-linear resistors or capacitors, thereby eliminating the necessity of titanium-silver vacuum deposition or conductive cermet application prior to lead attachment. Glass encapsulation may be accomplished simultaneous with the brazing operation to further reduce cost.

A circuit for converting an asymmetrical input signal applied to a single ended input terminal of the circuit to a symmetrical output voltage appearing across balanced differential outputs. The circuit includes first and second operational amplifiers, the outputs of which are the outputs of the circuit. The noninverting inputs of the two amplifiers being coupled to a reference voltage. The inverting input of the first amplifier being adapted to receive the input signal and further being coupled …

Dynamic focus circuitry for a CRT data display terminal provides high resolution even in the corners of the screen by means of a dynamic focus voltage which is the product of parabolic waveforms at horizontal line rate and vertical frame rate. The non-linear characteristic of a diode provides the product function at minimum expense.

An improved switch actuating apparatus operating dome switches in which a dome shaped switching member mounted on a circuit board is actuated by the action of an elongated button member urged in a linear direction or a pivotal direction into contact with the dome switching member against the action of a elastomeric member positioned between the elongated button member and dome switching member. The elastomeric member has an aperture formed therein through which a tip portion of the button member…

A communication device (100) is provided with a technique (400) for self-diagnosing an air leak. The leak is determined without having to open the communication device by applying a temporary excitation signal to the speaker terminals (402) to produce a damped response (404) and then monitoring the damped response (406) of the speaker.

A process for improving the continuity of overlayers above an aluminum metallization stripe on a semiconductor device which includes the step of forming a conversion coating on the surface of the aluminium metallization. The conversion coating has a higher etch rate than the aluminum per se, and hence after selective masking, a tapered or sloped edge is produced on the aluminum stripe which is more easily continuously overlayed by the further necessary layers.

A speaker apparatus which has a main speaker and at least one tweeter speaker in which a wire bridge member is used to support the tweeter speaker relative to the main speaker at a predetermined position therefrom. The wire bridge member is retained between the tweeter speaker and the tweeter speaker cover by pins which are heat staked. The wire bridge member has a circular center portion to accommodate the tweeter speaker and arm portions extending transversely and then inwardly at right angles…

A thermally stable encapsulant for a semiconductor substrate having high voltage devices disposed therein including a coating comprising a polymer having suitable polar characteristics and a metal oxide for depleting excess electron charge and for stablizing ionic contaminants during high voltage operation.

An improved method for encapsulating a semiconductor diode wherein a semiconductor chip and a pair of leads are surrounded by an insulating glass. The improvement comprising the providing of an alkaline free low temperature encapsulating glass for semiconductors consisting essentially of 11-15 weight percent silica, 7-11 weight percent alumina, 63-68 weight percent lead oxide, 4-10 weight percent lead fluoride and 5-10 weight percent borate.