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Results for ASSIGNEE: matsushita electric industrial co. ltd. AND FULL_TEXT: {matsushita electric industrial co. ltd. osaka jp}
Showing 1 – 10 of 19534
In an audio signal delay apparatus and methods, an audio signal modulated by biphase mark modulation is received and a header part of the audio signal is identified. Thereafter, a data part of the audio signal is demodulated to store the identification data and the demodulated data part in a memory, the identification data from the memory is read out to reconstruct the header part after a specified time. Subsequently, the data part is read out from the memory to modulate the data part by the bip…
 
A device for connecting tapes carrying electronic components, adapted for use in continuous automatic feed of electronic components. The device has a base plate on which are formed aligning pins adapted to be received by corresponding aligning holes defined in the abutting ends of the tapes to be connected, and a stapler slidably attached to the base plate and adapted for connecting the tapes by the stapler nails. In use, the tapes are so placed by inserting aligning holes thereof onto the corre…
 
A composite diaphragm for a speaker comprises a boron layer formed on a metal foil such as titanium foil, in which a layer of a low melting point metal such as aluminum or magnesium is interposed between the metal foil and the boron layer to provide high rigidity, high elasticity and high bonding strength between the metal foil and the boron layer.
 
A scalable tele-care monitoring device has a plurality of physiological sensors adapted to collect patient physiological data. The device also has an interface adapted to connect with a personal computer, and an expansion module adapted to communicate patient physiological data to the personal computer via the interface. In further aspects, the device has an output adapted to communicate the patient physiological data over a communications network when the device is not interfaced with the perso…
 
A polar-based modulator includes an amplitude signal generator operating at a set gain and a command module that selects an appropriate one parameter lookup table based on an identification of the current network communication system. The command module receives a digital representation of the desired amplitude and using the received digital amplitude and selected parameter lookup table determines control commands used by a scalar to appropriately modulate an amplitude modulated signal output fr…
 
A spindle motor includes a shaft including a core spindle member with a large and a small diameter portions and an encircling annulus member attached to the small diameter portion; a rotor hub attached to the large diameter portion; a bearing member; a radial bearing portion provided with first dynamic pressure creating grooves and formed between the outer peripheral surface of the encircling annulus member and the inner peripheral surface of the bearing member; a thrust bearing portion provided…
 
An electronic parts mounting apparatus and an electronic parts mounting method for picking up a plurality of electronic parts simultaneously by a transfer head having a plurality of suction nozzles from a plurality of tape feeders and then mounting the electronic parts on a substrate are provided. Displacement amounts of parts stop positions in respective tape feeders are detected in advance and stored as stop position correction data, and then tape feeding mechanisms are controlled based on the…
 
A drum type washing machine includes a housing; a water tub unit accommodated in the housing; a vibration damper, a lower portion thereof being fixed at a base portion of the housing; and a displacement detecting unit for detecting displacement of the water tub unit, the displacement detecting unit being disposed between the water tub unit and the base portion of the housing. The vibration damper supports the water tub unit at a position closer to a front side of the housing than the center of g…
 
A probe card for a wafer level test of electrical characteristics of a plurality of semiconductor integrated circuit devices formed on a semiconductor wafer. The card has a thin film with bumps on which a plurality of bumps to be respectively brought into contact with all of inspection electrodes of the semiconductor integrated circuit devices are formed, and which is held on a rigid ceramic ring. An alignment mark constituted by a bump formed simultaneously with the bumps for contact is added t…
 
A solid-state image sensor includes a plurality of light-receiving elements arranged in a light-receiving area, and a plurality of micro-lenses corresponding to the light-receiving elements, and has a flattening film formed on the plurality of the micro-lenses. At a center of the light-receiving area, the micro-lenses are placed in positions directly above corresponding photodiodes, and placed in positions which are progressively offset from positions directly above the corresponding photodiodes…
 
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