A new and improved solid-state image sensor uses a dynamic random access memory as the light sensitive element. The dynamic random access memory is mounted in a semiconductor package having a transparent lid, and one or more lenses focuses the light image onto the dynamic random access memory. A recording device or a display unit is provided. The new and improved solid-state sensor is particularly useful in low-cost applications, such as robots and toys.

Disclosed is a method of etching back a tungsten layer on a semiconductor wafer by a polishing process. The method comprises: exposing the wafer to be polished to a polishing solution at a preselected temperature, the polishing solution comprising an oxidizing component which oxidizes tungsten on the wafer to tungsten oxide; mechanically polishing the tungsten oxide from the wafer and into the polishing solution; and the polishing solution also comprising a dissolution component selected from th…

An improved aluminum alloy from which interconnect lines of VLSI integrated-circuit devices may be fabricated. The alloy, which is comprised of aluminum, copper, titanium and silicon, is not only resistant to electromigration and stress cracking, but produces silicon precipitate crystals which are much finer that those produced by aluminum-copper-silicon alloys under the hot-and-cold temperature cycling that is required by contemporary semiconductor fabrication processes. These fine silicon prec…

Apparatus to enclose a resistivity probe, to be used with a semiconductor wafer washer. Said apparatus is detachable and easy to maintain; is made of readily available and inexpensive plumbing parts; substantially encloses said probe, reducing contamination; allows nitrogen purge of said probe, keeping it clean; fully submerges said probe in discharge fluid, improving measurement accuracy; and is compact enough to allow washers to be triple stacked.

A method and apparatus for determining the level of particulate contamination in a plurality of liquid sources. The apparatus comprises first and second control valves each having a number of valve elements equal in number to the number of liquid sources, with analytical equipment to determine the amount of particulate contamination in a fluid sample, disposed therebetween. Samples are withdrawn from and returned to the same liquid source. A common valve controller insures that the control valve…

A method of preventing low temperature dry etch deposit on a semiconductor substrate wafer comprises: ceasing injection of reactive gas to within a dry etching reactor at substantial completion of a selective etch while maintaining sufficient power to the reactor to maintain gases therein in a plasma state; and substantially evacuating the reactive gas plasma from the reactor before decreasing power to the reactor below that which is sufficient to maintain gases therein in the plasma state.

A vessel for production of deionized water having increased resistance to corrosion and internal contamination. A throughpipe provided with external threads is welded to the domed bottom and the inner tank bottom and extends into the interior of the vessel. A corrosion-resistant coating is applied to the interior of the vessel and partially upwardly on the threaded portion of the throughpipe such that the gasket prevents deionized water and other corrosive materials from attacking and delaminati…

A fluid level sensor is provided in a fluid dispensing system, primarily in a photoresist dispensing system used in a semiconductor manufacturing process. A bubble is introduced into the fluid shortly before fluid supply is emptied, said bubble being used to detect a low fluid level. The invention uses a snap-on combination cap and pickup tube, the pickup tube having a small hole near its lower tip, and the cap containing an optical bubble detector.

A decoupling capacitor system for improving the reliability of digital logic circuit boards such as single inline memory modules which use surface-mount decoupling capacitors. The system comprises one or more units of two or more series-connected capacitors connected between the chip supply voltage (Vcc) input and the chip ground (Vss) connection. Given no change in the reliability of the individual capacitors, the reliability of a circuit board can typically be improved by several order of magn…

A printed circuit board is designed to conform to a single in-line memory module (SIMM) configuration, but includes multiple rows of the memory devices. By controlling a sequence of enable signals, selection of a single row from the multiple row of memory devices can be accomplished. The ability to address the different rows multiplies the memory capacity of the board by the number of rows of memory devices.